IC backend service firms to lock in orders for new iPhone launch

Disconnected ICT Supply Chains: New Power Plays Unfolding

REALTIME NEWS

TSMC to expand capacity for mature processes

Before Going to Press

Novatek ramping up 28nm wafer starts at UMC

Before Going to Press

Ennostar sees 1Q21 gross margin at double-digits

Before Going to Press

Macroblock sees supply for mini LED products fall short

Before Going to Press

ASE lands FC-AiP orders for new iPad Pro

Before Going to Press

Nichidenbo upbeat about passive component demand for 5G, EV

Before Going to Press

Shipments for new iPad Pro to boost Foxconn revenue starting April

Before Going to Press

Holtek reportedly stops taking orders for 2022

Before Going to Press

Home News Bits + chips

IC backend service firms to lock in orders for new iPhone launch

Julian Ho, Taipei; Steve Shen, DIGITIMES Monday 2 September 2019 0

Apple has sent out invitations for a new product event on September 10 signaling that Taiwan's IC backend service firms are set to land related orders for new iPhones as expected in the third quarter, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

LOGIN

Email address

Passwords

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW users please REGISTER first.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Customizable email including up to all our daily news.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Before Going to Press.

Categories

Bits + chips IC design, distribution IC manufacturing Mobile + telecom Mobile components

Tags

Apple ASE Chipbond IC KYEC packaging and testing TSMC

Companies

Advanced Semiconductor Engineering Chipbond Technology King Yuan Electronics Company Taiwan Semiconductor Manufacturing Company

Related stories

Disconnected ICT Supply Chains: New Power Plays Unfolding

Manz intelligent production solutions enable new business growth

Global LCD panel shipment forecast, 2021 and beyond

RESEARCH INSIGHTS

ICs play bigger role in Taiwan exports

TIP helps Indonesian telecom carriers test Open RAN

Arm-based server solutions to expand presence in edge computing market