中文網
Taipei
Sun, Apr 11, 2021
14:04
mostly clear
27°C
CONNECT WITH US
PTI fan-out panel-level packaging attracts orders for HPC chips
Julian Ho, Taipei; Jessie Shen, DIGITIMES 0

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking applications from China- and Taiwan-based fabless firms, according...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories