中文網
Taipei
Thu, May 13, 2021
15:08
mostly clear
32°C
CONNECT WITH US
PTI advanced packaging draws new orders from Intel
Julian Ho, Taipei; Jessie Shen, DIGITIMES 0

Taiwan-based Powertech Technology (PTI) is working closely with Intel and will be engaged in the packaging services for the chip giant's upcoming QLC 3D NAND and heterogeneous chip solutions slated for launch in 2020, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories