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PTI chair sees FOPLP as alternative solution for IC scaling
Julian Ho, Taipei; Willis Ke, DIGITIMES 0
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FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that can achieve IC scaling without adopting costly advanced fabrication...

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Bits + chips IC manufacturing Memory chips
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capex HPC IC packaging PTI Samsung Electronics SoC testing
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