Bits + chips
TSMC, Broadcom enhance CoWoS platform with 2X reticle size interposer
Jessie Shen, DIGITIMES, Taipei

TSMC announced on March 3 the foundry has collaborated with Broadcom on enhancing the chip-on-wafer-on-substrate (CoWoS) platform to support the industry's first and largest 2X reticle size interposer.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.