Bits + chips
Highlights of the day: TSMC eyeing supercomputer chips
DIGITIMES staff

TSMC has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips. Demand for such extremely costly chips may be limited, but TSMC looks to commercialize the InFO_SoW technology in two years. Menawhile, TSMC's aggressive capacity expansion is set to boost sales of Taiwan-based equipment and materials suppliers, as the foundry moves to source more from the local ecosystem partners. Meanwhile, Taiwanese PCB makers see poor order visibility from Chinese handset vendors for second-half 2020.

TSMC may commercialize InFO_SoW for supercomputer AI chips in two years: TSMC, after launching 3D SoIC backend service, has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips and is expected to enter commercial production with the InFO-derived process within two years, according to sources familiar with the advanced packaging process.

TSMC fab tool suppliers see promising outlook: Taiwan-based semiconductor equipment suppliers engaged in TSMC's supply chain are set to be among the beneficiaries of the foundry house's advanced process capacity expansion with their short- and mid-term growth outlook promising, according to industry sources.

PCB makers cautious about 2H20 shipments to Chinese handset vendors: Taiwan's PCB makers have turned cautious about their shipments for non-Apple handset applications in the second half of the year as most Chinese vendors have yet to give clear shipment estimates so far although traditional seasonal demand should still arrive, according to industry sources.

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