Bits + chips
TSMC to talk about sub-3nm process, SoIC at upcoming tech forums
Monica Chen, Taipei; Jessie Shen, DIGITIMES

TSMC at its upcoming technology symposiums will disclose more details about the foundry's 3nm and 2nm process nodes, and advanced 3D heterogeneous integration technology, such as SoIC (system-on-integrated chips) packaging.

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