中文網
Taipei
Sun, Aug 14, 2022
06:17
partly cloudy
27°C
CONNECT WITH US

TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform

Monica Chen, Taipei; Willis Ke, DIGITIMES Asia 0

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly unveiled 3D Fabric wafer level system integration technology platform,...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories