Chipmakers to ramp up 176-layer 3D NAND chip output in 2H21

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Chipmakers to ramp up 176-layer 3D NAND chip output in 2H21

Siu Han, Taipei; Jessie Shen, DIGITIMES Tuesday 15 December 2020 0

Chipmakers including Micron Technology and SK Hynix have introduced the availability of their 176-layer 3D NAND flash chips, and are expected to ramp up the chip output for UFS and SSD and other applications requiring large storage capacity starting...

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Categories

Bits + chips Memory chips

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2020 3D AI China demand DRAM edge computing flash Hynix manufacturing Micron Micron Technology NAND NAND flash Samsung shipments SK Hynix SSD storage

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