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ABF substrate technology advancing fast, says Unimicron chairman

Jay Liu, Taipei; Willis Ke, DIGITIMES 0

Production technology for ABF substrates will be evolving rapidly to satisfy demand for HPC and other high-end chips, according to Tzyy-Jang Tseng, chairman for Unimicron technology. Designs with sub-5 micron features could be developed by 2025, said...

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