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TSMC, Unimicron to offer production solutions for Apple M1 Ultra

Jay Liu, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: Apple

Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging technology, with the required ABF substrates to be solely supplied...

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