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China OSAT growing advanced packaging capability

Julian Ho, Taipei; Willis Ke, DIGITIMES 0

Credit: HiSilicon

Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC, and other advanced packaging R&D and manufacturing capability, according...

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