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High-end IC testing demand to stay robust in 2H22

Julian Ho, Taipei; Eifeh Strom, DIGITIMES Asia 0

Credit: DIGITIMES

Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server device applications, which will fill up related bumping, flip chip...

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