中文網
Taipei
Mon, Aug 8, 2022
10:07
clear
31°C
CONNECT WITH US

Substrate-free FOPLP technology gaining ground in advanced packaging market

Rebecca Kuo, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: DIGITIMES

Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which will accelerate the entry of substrate-free fan-out (FO) backend solutions,...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories