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NEWS TAGGED 22NM
Thursday 28 July 2022
UMC expects fab capacity to stay fully utilized in 3Q22
United Microelectronics (UMC) will continue to run its fabs at full capacity utilization in the third quarter of 2022 when the pure-play foundry expects to post flat sequential increases...
Tuesday 26 July 2022
What's behind the MediaTek-Intel partnership?
MediaTek has newly clinched a strategic cooperation deal with Intel, sparking speculation over whether the deal will affect its partnership with TSMC or will give it more bargaining...
Thursday 26 May 2022
UMC makes progress in new fab establishment
Pure-play foundry United Microelectronics (UMC) is making progress in the establishment of new 12-inch fabs at its manufacturing sites in southern Taiwan and Singapore, according...
Wednesday 27 April 2022
Pure-play foundries see automotive chip orders continue ramping up
Taiwan-based pure-play foundries continue to see orders for automotive semiconductors ramp up while stepping up their capacity expansion pace, according to industry sources.
Tuesday 22 March 2022
TSMC to see orders for auto chips ramp up
TSMC is expected to see orders for automotive electronics chips rise at a faster-than-expected pace, according to industry sources.
Tuesday 1 March 2022
New UMC fab in Singapore to generate profit in 1st year of operation
Pure-play foundry United Microelectronics' (UMC) new 12-inch fab in Singapore is expected to generate profits in its first year of operation, according to industry sources.
Friday 25 February 2022
UMC to expand Singapore fab site for additional 22/28nm process capacity
United Microelectronics (UMC) has announced plans to set up a new advanced manufacturing facility adjacent to its Fab12i in Singapore. Dubbed Fab12i P3, the facility is designed for...
Tuesday 1 February 2022
New semiconductor fabs in Japan to go online in 2022-2024
With the Japan government stepping up their support for the local IC manufacturing sector, several new wafer fabs, including a joint venture (JV) between TSMC and Sony, will be constructed...
Thursday 27 January 2022
UMC warns of potential 28nm chip oversupply
The 28nm process market segment may experience an oversupply beyond 2023, according Jason Wang, president for pure-play foundry United Microelectronics (UMC).
Thursday 13 January 2022
What motivates TSMC to spend big on capacity expansion
TSMC's planned US$100 billion in capex from 2021 to 2023 will not be sufficient to carry out its capacity expansion projects in Taiwan and overseas, market observers believe. The...
Monday 29 November 2021
New IC fab projects to draw government subsidies in Japan
TSMC, Kioxia and Micron Technology are reportedly expected to receive government subsidies in Japan to support their new fabs or expansion projects locally in Japan.
Wednesday 10 November 2021
TSMC, Sony to form JV foundry in Japan
TSMC and Sony Semiconductor Solutions (SSS) have jointly announced plans to establish a joint-venture foundry in Kumamoto, Japan to initially provide 22nm and 28nm process manufacturing...
Friday 15 October 2021
TSMC sees fab capacity stay tight, mulls new fab in Japan
TSMC will see its 12- and 8-inch fab capacities stay tight in 2021 and throughout 2022, and is gearing up for its next stage of growth, said company CEO CC Wei at an earnings earnings...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Monday 30 August 2021
NAND flash controller prices to rise in 4Q21
NAND flash device controller chip prices are under increasingly upward pressure, as foundries are set to initiate further price hikes for mature process technologies later this year...
Friday 13 September 2013
IDF San Francisco 2013: Intel Xeon E5-2600 v2 product family
Intel has introduced the Xeon processor E5-2600 v2 product family (Ivy Bridge-EP), which is based on Intel's 22nm process technology, contributing to energy efficiency improvements of up to 451% when compared to the previous generation, according to the vendor. The processor family also features up to 12 cores and delivers up to 50% more performance across variety of compute intensive workloads. The Intel Xeon processors E5-2600 v2 product family will power the new IBM NeXtScale System, a high-density, flexible computing platform designed for high-demand workloads such as analytics, technical computing and cloud delivery. Intel's newest processor family also will be used in IBM's new x3650 M4 HD high-density storage server, as well as all of IBM's two-socket systems including System x racks and towers, Flex System, iDataPlex, and BladeCenter offerings.
Monday 9 September 2013
Intel Atom C2000 processor
Intel has unveiled its second-generation 64-bit Intel Atom C2000 product family of system-on-chip (SoC) designs for microservers and cold storage platforms (Avoton) and for entry networking platforms (Rangeley). These new SoCs are the company's first products based on the Silvermont micro-architecture, the new design in its 22nm Tri-Gate SoC process delivering increases in performance and energy efficiency. Manufactured using Intel's 22nm process technology, the Intel Atom C2000 product family features up to eight cores, a range of 6-20W TDP, integrated Ethernet and support for up to 64GB of memory, eight times the previous generation.
Wednesday 5 June 2013
Intel fourth-generation Core processor (Haswell)
Intel has introduced the fourth-generation Intel Core processor family, providing responsive, secure and powerful performance for consumers to create and consume content. With power levels as low as 6W in scenario design power, Intel is enabling thinner, lighter, cooler, quieter and fanless designs. The fourth-generation Intel Core processors are capable of delivering up to 15% better performance than the previous generation, the vendor said. Consumer and business systems based on quad-core versions of fourth-generation Intel Core processors are now available. Summer availability is planned for 2-in-1s ultrabooks, portable all-in-ones and traditional notebooks and desktops. New mobile business products with fourth-generation Intel Core vPro will be available later this year. The fourth-generation Intel Core processors can bring an 50% improvement in battery life over the previous generation in active workloads when watching movies or surfing the Internet, and two to three times improvement in standby battery life. For some systems coming to market this year, over nine hours of active use battery life or 10-13 days of standby with fresh data on a single charge is expected. To achieve this breakthrough, Intel significantly reduced the CPU power to as low as 6W and also worked across the system for power optimization. These improvements range from system-on-a-chip (SoC) and platform level technologies to Intel's 22nm process technology.
Aug 3, 11:10
ADATA Industrial launches industrial-grade DDR5 ECC U-DIMM and ECC SO-DIMM memory modules
Wednesday 27 July 2022
MEAN WELL develops energy-conserving, green energy products to help move towards ESG
Wednesday 27 July 2022
Next-generation controller + multi-power supply: MEAN WELL provides most "usable" solution
Tuesday 26 July 2022
STAr Technologies releases new test software for advanced wafer-level reliability qualification
MacBook series to outshine other PC brands in 2H22
Taiwan foundries intend to hold prices flat
Notebook shipments may slip below 200 million units in 2022
Pegatron denies reports about China blocking shipments
Micron and WD proposes to form memory coalition amid fierce competition with China and Korea
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
Chinese smartphone brands see declines in 2Q22, says DIGITIMES Research
Apple to diversify MacBook production in China, says DIGITIMES Research
Notebook brands to see oversupply of some components in 3Q22, says DIGITIMES Research
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