Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology. Powered by two Cortex-A53 cores, the Exynos 7270 makes full use of the 14nm process, delivering 20% improvement in power efficiency when compared to its predecessor built on 28nm, and thus notably extending the battery life, Samsung said. By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM radio, and location-based services with GNSS (global navigation satellite system) solutions.

Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone market as well as other IoT devices. Last year, Samsung adopted advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices. Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 improvements in CPU performance and 30% improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS. Additionally, with design optimization and feature consolidation for components such as PMICs and RF functionalities, Exynos 7570 reduces the total chipset size by up to 20%, giving manufacturers better ability to craft slimmer smartphones, according to Samsung. It supports screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras.

Samsung Electronics has announced a 12-megapixel image sensor for smartphones. Already in mass production, this 1.4 micron-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras. Samsung's new image sensor with Dual Pixel technology employs two photodiodes located on the left and right halves of a pixel, while a conventional image sensor dedicates less than 5% of its pixels, with one photodiode each that converts light particles into measurable photocurrent for phase detection. As each and every pixel of the Dual Pixel image sensor is capable of detecting phase differences of perceived light, significantly faster auto-focus has become possible. The image sensor has also adopted Samsung's ISOCELL technology, which isolates the photodiodes in each pixel with a physical wall to further reduce color cross talk, maximizing the image sensor's performance. For top-of-the-line performance while keeping the size to a minimum, the new image sensor is built with cutting-edge chip-stacking technology. The Dual Pixel image sensor stacks a 65nm sensor and 28nm logic chip together to deliver outstanding photo-taking experiences in today's sleek smartphones.