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NEWS TAGGED 300MM
Monday 1 August 2022
Denso launches new RC-IGBT for EV, reducing energy loss by 20%
Japan's top automotive components supplier Denso is keen to develop and produce automotive power chips on its own, and has just unveiled a new power semiconductor device for electrical...
Tuesday 12 July 2022
ST, GF team up for 300mm wafer fab in France
STMicroelectronics and GlobalFoundries have signed a MoU to build a 300mm semiconductor manufacturing facility in France, according to the chipmakers.
Thursday 23 June 2022
GF starts equipment move-in at new Singapore fab
GlobalFoundries has kicked off equipment move-in at the foundry's new facility on its Singapore campus, with the first tool - a market-leading etch tool made by Lam Research - moved...
Thursday 19 May 2022
TI breaks ground on 300mm wafer fabs in Texas
Texas Instruments (TI) has disclosed it has broken ground on its new 300mm semiconductor wafer fabrication plants in Sherman, Texas.
Thursday 19 May 2022
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
Renesas Electronics has announced plans to reopen its Kofu factory located in Kai City, Yamanashi Prefecture as a 300mm wafer fab capable of manufacturing power semiconductors. The...
Thursday 28 April 2022
UMC sees gross margin top 40% in 1Q22
Pure-play foundry United Microelectronics (UMC) saw its gross margin climb to 43.4% in the first quarter of 2022, which beat its guidance given earlier this year, buoyed by fully-utilized...
Wednesday 27 April 2022
Denso, USJC team up for automotive power semiconductors
Denso and United Semiconductor Japan (USJC), a subsidiary of Taiwan-based United Microelectronics (UMC), have announced they will partner to manufacture automotive power semiconduc...
Monday 25 April 2022
IC wafer capacity to climb 8.7% as 10 new fabs enter production
IC wafer capacity is forecast to grow 8.7% in 2022 after rising 8.5% in 2021, thanks to the addition of 10 new 300mm fabs that are scheduled to open this year, according to IC Insi...
Monday 21 March 2022
Silicon wafer suppliers continue to see orders from foundries despite end-market slowdown concerns
Silicon wafer companies and other upstream chipmaking material providers continue to see their production capacities fully utilized by the still strong pull-in of orders from foundries,...
Monday 14 March 2022
Silicon wafer firm NSIG raises CNY5 billion
China's National Silicon Industry Group (NSIG) announced recently that it has raised an additional CNY5 billion (US$787 million) in paid-in capital through private placement, with...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Friday 25 February 2022
UMC to expand Singapore fab site for additional 22/28nm process capacity
United Microelectronics (UMC) has announced plans to set up a new advanced manufacturing facility adjacent to its Fab12i in Singapore. Dubbed Fab12i P3, the facility is designed for...
Thursday 24 February 2022
Bosch to expand fab site in Reutlingen
Bosch has announced that in an additional move to combat the ongoing global chip shortage, the company plans to further extend its fab site in Reutlingen, Germany. More than EUR250...
Wednesday 9 February 2022
Toshiba to split into two standalone companies
Toshiba has provided an update on its reorganization plan disclosed in November 2021, announcing its intention to separate the company into two standalone companies - Toshiba Infrastructure...
Friday 4 February 2022
Toshiba regards Thailand as manufacturing hub of discrete semiconductors
Toshiba Semiconductor (Thailand) is an important contributor to Toshiba's network of companies which provide a robust supply of discrete semiconductors. As Toshiba's largest semiconductor...