TSMC is on track to move 3nm process technology to risk production in 2021 followed by volume production in the second half of 2022, according to the pure-play foundry.

GaAs foundry Win Semiconductors has reported revenue climbed 18.8% on year to a record high of NT$25.37 billion (US$905.71 million) in 2020.

Time of flight (ToF) 3D sensors are emerging rapidly for massive consumer applications, prompting major semiconductor and optoelectronics players to join the supply chain and accelerating...

The market for NAND flash memory remains oversupplied, but shortages of flash device controllers and passive components have constrained the supply of SSD and other related peripherals,...

Taiwan's Ministry of Science and Technology (MOST) has unveiled a new R&D program designed to encourage academic research teams to develop critical technologies for sub-nanometer...

Chipmakers including Micron Technology and SK Hynix have introduced the availability of their 176-layer 3D NAND flash chips, and are expected to ramp up the chip output for UFS and...

Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...

Apple's adopting LiDAR based on dToF (direct time of flight) for iPhone 12 Pro, iPhone 12 Pro Max and iPad (2020) is expected to prompt Android smartphone vendors to follow suit,...

Moore's Law will continue to be embraced as sort of a faith when it becomes inapplicable, but chiplets will have a chance to become the mainstream in future IC design, according to...

Taiwan's top test interface specialist Chunghwa Precision Test Tech (CHPT) and TSMC's re-invested backend house Xintec are both optimistic about their revenue prospects for fourth-quarter...

To expand presence in the automotive memory market, Macronix International has disclosed plans to enter volume production of 96-layer 3D NAND memory for automotive applications in...

Micron Technology has begun volume shipments of what the company claims is the world's first 176-layer 3D NAND flash memory.

Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...

IC testing solution provider Chunghwa Precision Test Tech (CHPT) and 3D sensor components packager Xintec have posted impressive revenue gains for the first three quarters of 2020...

Digital camera ODM and imaging solution provider Altek has developed 3D depth-sensing modules based on stereopsis technology and expects adoption for such modules to begin to increase...

GaAs foundry Win Semiconductors expects to post a revenue increase of 1-3% sequentially in the fourth quarter of 2020, with gross margin ranging from 37% to 39%.

Kioxia has announced it will begin to construct a fabrication facility, dubbed Fab 7, at its factory site in Yokkaichi, Japan to expand production of its proprietary 3D flash memory...

Macronix International, a supplier of mask ROM and flash memory, expects its in-house developed 48-layer 3D NAND products to start generating revenue in 2021.

Intel and SK Hynix have signed an agreement under which the latter would acquire the former's NAND memory and storage business for US$9 billion, according to the companies.

GaAs foundry Win Semiconductor and its backend partners including Elite Advanced Laser (eLaser) are engaged in production of VCSEL chips for ToF-based LiDAR scanner for the iPhone...

SSD developer Innodisk has rolled out its new 96-layer 3D TLC device lineup for enterprise and industrial applications, and is gearing up for end-market demand recovery next year.

GaAs foundry Win Semiconductors continues to enjoy a strong influx of orders for 5G PA and VCSEL components with clear order visibility through the fourth quarter, despite no orders...

Taiwan's optical filter specialist Kingray Photoelectric Technology is set to expand monthly production capacity for narrow band pass filter (NBPF) for 3D ToF (time of flight) modules...

ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...