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NEWS TAGGED 3D
Wednesday 28 July 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
Wednesday 28 July 2021
TSMC on track for bold overseas manufacturing deployments
Following its move to set up a 5nm chips fabrication plant in the US and expand foundry capacity in China, TSMC has recently confirmed its intentions to build fabs in Japan and Germany...
Tuesday 27 July 2021
Taiwan compound semiconductor output value surges 26% in 1H21
The output value of Taiwan's compound semiconductor industry grew 26.4% on year to NT$36 billion (US$1.28 billion) in the first half of 2021, according to statistics compiled by the...
Tuesday 27 July 2021
Intel unveils technology roadmap to power products through 2025 and beyond
Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.
Monday 19 July 2021
Chip probing houses to gain from new iPhone SE series, say sources
Apple reportedly is set to roll out its third-generation iPhone SE series in the first half of 2022, providing new business opportunities for chip probing specialists including TSMC...
Thursday 15 July 2021
GaAs IC firms to see strong PA demand for 5G handsets,Wi-Fi 6E devices in 2H21
GaAs IC foundries Win Semiconductors and Advanced Wireless Semiconductor Company (AWSC), and GaAs epi-wafer supplier Visual Photonics Epitaxy Company (VPEC) are all poised to log...
Tuesday 29 June 2021
MIH may stretch into autonomous driving
MIH Consortium, a Foxconn-led open EV ecosystem, may extend its business tentacle into the self-driving segment as quite a few startups from the segment are now members of the alliance...
Friday 25 June 2021
YMTC 128-layer 3D NAND process yield rates lower-than-expected
Yield rates for Yangtze Memory Technologies' (YMTC) 128-layer 3D NAND flash process technology remain insufficient for commercial production, according to industry sources.
Wednesday 9 June 2021
Apple to increase VCM orders starting June for new iPhones
Taiwan-based voice coil motor (VCM) suppliers expect order pull-ins from Apple to gradually turn strong starting from June as the US brand is expected to release its next-generation...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Tuesday 1 June 2021
China makers gaining weight on Apple top-200 supplier list
China-based makers have been gaining presence in the Apple's supply chain, with 12 new makers from the country entering the vendor's newly released top-200 supplier list for 2020,...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 24 May 2021
Solidworks expects surging sales from cloud computing business in 2021
Solidworks, a developer of 3D engineering CAD software under Dassault Systemes, expects its sales from cloud computing-related businesses in 2021 to surge 6- to 7-fold from a year...