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NEWS TAGGED 3D
Wednesday 29 June 2022
ADATA launches industrial-grade 31C series 112-Layer 3D NAND (BiCS5) solid state drives
ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products, today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5)...
Monday 27 June 2022
TSMC completes cleanroom construction at R&D center in Japan
An opening ceremony has been held recently at TSMC's 3DIC R&D center in Japan to mark the completion of cleanroom construction at the facility, according to the Taiwan-based fo...
Tuesday 14 June 2022
Yangtze Memory to move directly to 232-layer 3D NAND production
NAND flash chipmaker Yangtze Memory Technologies (YMTC) plans to skip the 192-layer generation and move directly to 232 layers, according to industry sources in China.
Monday 13 June 2022
Micron to commercialize 1-gamma EUV process in Taiwan in 2024
US memory vendor Micron Technology is set to move its 1-gamma EUV process technology to volume production at its new fab, A3, in central Taiwan in 2024, and will install the first...
Friday 10 June 2022
5G just at first generation with much to be desired, says NCC commissioner
A recent global survey by telecom equipment vendor Ericsson found that many people are disappointed with 5G because no killer applications are in sight, which, however, can be attributed...
Thursday 2 June 2022
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Thursday 2 June 2022
TSMC to boost ties with memory chip vendors
TSMC is poised to boost its ties with memory chip vendors including Micron Technology and SK Hynix to strengthen the logic foundry's 3D silicon stacking and other advanced packaging...
Monday 30 May 2022
PA, DDI backend houses see stable shipments for Apple devices
Despite uncertainties in chip demand for handsets, TV and other consumer electronics devices, Taiwan's backend suppliers including ASE Technologies, Chipbond Technology and III-V...
Friday 27 May 2022
AR/VR headsets to usher in opportunities for 3D, SWIR sensor suppliers
AR/VR headset could be a tipping point for 3D-sensor-related optical components and sensor technology, driving new opportunities for 3D sensor suppliers in the augmented reality (AR)...
Thursday 26 May 2022
Artilux intros GeSi sensor solution for TWS devices
Artilux has introduced its new GeSi sensor solution based on the company's CMOS SWIR (short-wave infrared) optical sensing technology for TWS earbuds and other wearables, which will...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Friday 20 May 2022
Adoption of QLC SSDs to accelerate in 2023
Chipmakers' entry into the race for 200-plus-layer 3D NAND flash chips will be accelerating the adoption of QLC SSDs particularly in the consumer sector in 2023, according to industry...
Thursday 19 May 2022
Acer announces new PCs and hardware for back-to-school season
Acer has launched new Chromebooks, ultra-thin notebooks, gaming notebooks, all-in-one (AIO) PCs, and monitors for upcoming back-to-school demand.
Wednesday 18 May 2022
3D measurement solutions gaining importance in EV production
As power systems of EVs differ greatly from those of oil-fueled cars, automakers require innovative technologies to manufacture and assemble key system components, leading to a growing...
Tuesday 17 May 2022
BujiBui makes 3D digital twins accessible anywhere
Utilizing 3D digital twins to operate facilities has become common for enterprises. BujiBui, a Canada-based startup, levels up its digital twins by offering mobile access. The company...