ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products, today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5)...
An opening ceremony has been held recently at TSMC's 3DIC R&D center in Japan to mark the completion of cleanroom construction at the facility, according to the Taiwan-based fo...
NAND flash chipmaker Yangtze Memory Technologies (YMTC) plans to skip the 192-layer generation and move directly to 232 layers, according to industry sources in China.
US memory vendor Micron Technology is set to move its 1-gamma EUV process technology to volume production at its new fab, A3, in central Taiwan in 2024, and will install the first...
A recent global survey by telecom equipment vendor Ericsson found that many people are disappointed with 5G because no killer applications are in sight, which, however, can be attributed...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
TSMC is poised to boost its ties with memory chip vendors including Micron Technology and SK Hynix to strengthen the logic foundry's 3D silicon stacking and other advanced packaging...
Despite uncertainties in chip demand for handsets, TV and other consumer electronics devices, Taiwan's backend suppliers including ASE Technologies, Chipbond Technology and III-V...
AR/VR headset could be a tipping point for 3D-sensor-related optical components and sensor technology, driving new opportunities for 3D sensor suppliers in the augmented reality (AR)...
Artilux has introduced its new GeSi sensor solution based on the company's CMOS SWIR (short-wave infrared) optical sensing technology for TWS earbuds and other wearables, which will...
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Chipmakers' entry into the race for 200-plus-layer 3D NAND flash chips will be accelerating the adoption of QLC SSDs particularly in the consumer sector in 2023, according to industry...
As power systems of EVs differ greatly from those of oil-fueled cars, automakers require innovative technologies to manufacture and assemble key system components, leading to a growing...
Utilizing 3D digital twins to operate facilities has become common for enterprises. BujiBui, a Canada-based startup, levels up its digital twins by offering mobile access. The company...