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Wednesday 22 September 2021
YMTC ready to volume produce 128-layer QLC NAND flash
China-based Yangtz Memory Technologies (YMTC) has shipped over 300 million 64-layer 3D NAND flash memory chips and is ready to volume produce 128-layer QLC (quad-level cell) NAND,...
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Wednesday 8 September 2021
IC analyzer MA-tek sees robust orders for AI chips, 3rd-gen semiconductors
IC analysis and certification lab Material Analysis Technology (MA-tek) has enjoyed a strong influx of MA (materials analysis) and FA (failure analysis) orders for AI chips and third-generation...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Tuesday 31 August 2021
TSMC launches advanced packaging for silicon photonics applications
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Tuesday 24 August 2021
YMTC sees low yield rates for 128-layer 3D NAND flash
China's Yangtze Memory Technologies (YMTC) continues to suffer from low yield rates for 128-layer 3D NAND flash manufacturing, which are estimated at only 30-40%, according to market...
Wednesday 18 August 2021
Macronix to enhance 3D NAND, advanced NOR flash offerings
Macronix International will be strengthening its 3D NAND and advanced NOR flash offerings, eyeing a bigger presence in the automotive and other niche-market sectors, according to...
Tuesday 17 August 2021
Backend houses enjoy strong influx of orders for automotive CIS
Taiwan-based backend houses, including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC), and Xintec, have seen orders from international IDMs continue ramping up for...
Friday 13 August 2021
Xintec optimistic about 3Q21
Taiwan-based CIS and 3D sensor packaging specialist Xintec has expressed optimism about its sales performance in the third quarter of 2021, thanks to a seasonal pick-up in demand...
Monday 2 August 2021
YMTC starts shipping 128-layer 3D NAND flash for China homegrown SSD
Yangtze Memory Technologies (YMTC) has kicked off mass production of 128-layer 3D NAND flash memory for a home-grown SSD series, according to industry sources.
Wednesday 28 July 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
Wednesday 28 July 2021
TSMC on track for bold overseas manufacturing deployments
Following its move to set up a 5nm chips fabrication plant in the US and expand foundry capacity in China, TSMC has recently confirmed its intentions to build fabs in Japan and Germany...
Tuesday 27 July 2021
Taiwan compound semiconductor output value surges 26% in 1H21
The output value of Taiwan's compound semiconductor industry grew 26.4% on year to NT$36 billion (US$1.28 billion) in the first half of 2021, according to statistics compiled by the...
Tuesday 27 July 2021
Intel unveils technology roadmap to power products through 2025 and beyond
Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.
Monday 19 July 2021
Chip probing houses to gain from new iPhone SE series, say sources
Apple reportedly is set to roll out its third-generation iPhone SE series in the first half of 2022, providing new business opportunities for chip probing specialists including TSMC...