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NEWS TAGGED 3D
Friday 26 February 2021
Kioxia breaks ground for new 3D NAND wafer fab
Kioxia held a groundbreaking ceremony for a semiconductor fabrication facility, dubbed Fab 7, at its factory site in Yokkaichi, Japan on February 24. The facility will be dedicated...
Friday 19 February 2021
Kioxia, Western Digital announce 6th-gen 3D flash memory
Kioxia and Western Digital jointly announced they have developed their sixth-generation, 162-layer 3D flash memory technology.
Monday 8 February 2021
NAND vendors to enter production race for over-100-layer offerings in 2021
As NAND flash stacking technology continues to advance, vendors will be racing for mass production of 3D TLC/QLC (triple/quad-level cell) NAND chips with over 100 layers in 2021 after...
Thursday 4 February 2021
Win Semi expects PA shipments for 5G handsets to double in 2021
GaAs foundry Win Semiconductors expects sales of power amplifiers (PA) for 5G handsets to climb to 30-40% of its total PA revenues in 2021, with shipments for Wi-Fi 6E applications...
Friday 15 January 2021
TSMC on track to move 3nm process to risk production in 2021
TSMC is on track to move 3nm process technology to risk production in 2021 followed by volume production in the second half of 2022, according to the pure-play foundry.
Thursday 7 January 2021
Win Semi posts record 2020 revenue
GaAs foundry Win Semiconductors has reported revenue climbed 18.8% on year to a record high of NT$25.37 billion (US$905.71 million) in 2020.
Tuesday 5 January 2021
ToF 3D sensors to accelerate AR application ecosystem formation, says Digitimes Research
Time of flight (ToF) 3D sensors are emerging rapidly for massive consumer applications, prompting major semiconductor and optoelectronics players to join the supply chain and accelerating...
Monday 21 December 2020
SSD supply constrained by chip shortages
The market for NAND flash memory remains oversupplied, but shortages of flash device controllers and passive components have constrained the supply of SSD and other related peripherals,...
Tuesday 15 December 2020
Taiwan to kick off advanced IC R&D project for next decade
Taiwan's Ministry of Science and Technology (MOST) has unveiled a new R&D program designed to encourage academic research teams to develop critical technologies for sub-nanometer...
Tuesday 15 December 2020
Chipmakers to ramp up 176-layer 3D NAND chip output in 2H21
Chipmakers including Micron Technology and SK Hynix have introduced the availability of their 176-layer 3D NAND flash chips, and are expected to ramp up the chip output for UFS and...
Tuesday 8 December 2020
Xintec, ShunSin see robust backend orders
Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...
Tuesday 8 December 2020
dToF likely to be mainstream 3D depth-sensing technology in 2021
Apple's adopting LiDAR based on dToF (direct time of flight) for iPhone 12 Pro, iPhone 12 Pro Max and iPad (2020) is expected to prompt Android smartphone vendors to follow suit,...
Tuesday 24 November 2020
The 'curse' of chip scaling
Moore's Law will continue to be embraced as sort of a faith when it becomes inapplicable, but chiplets will have a chance to become the mainstream in future IC design, according to...
Tuesday 17 November 2020
CHPT, Xintec positive about 4Q20 on strong shipments for Apple devices
Taiwan's top test interface specialist Chunghwa Precision Test Tech (CHPT) and TSMC's re-invested backend house Xintec are both optimistic about their revenue prospects for fourth-quarter...
Friday 13 November 2020
Macronix, Winbond stepping up automotive NAND deployments
To expand presence in the automotive memory market, Macronix International has disclosed plans to enter volume production of 96-layer 3D NAND memory for automotive applications in...