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NEWS TAGGED 3D
Tuesday 15 September 2020
TSMC, Samsung scaling up competition in advanced chips packaging
TSMC and Samsung Electronics have seen their competition significantly heat up in advanced packaging technologies beyond foundry processes, which could eventually dent business opportunities...
Wednesday 9 September 2020
OSAT providers to enjoy impressive SiP sales growth in 2020
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
Wednesday 9 September 2020
Suppliers gearing up for SiP demand boom
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
Tuesday 8 September 2020
Chips R&D matters: Q&A with iST chairman Danny Yu
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...
Wednesday 26 August 2020
Win Semi reiterates positive 3Q20 outlook
GaAs foundry Win Semiconductors has reiterated its third-quarter 2020 revenues will post a sequential growth of 4-6% with gross margin staying at over 40%, despite uncertainty in...
Monday 24 August 2020
TSMC packaging development to remain focused on SoIC, organic interposer in 2021
TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...
Monday 24 August 2020
Samsung stepping up efforts for advanced chip packaging
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
Friday 21 August 2020
Coretronic Intelligent Robotics develops 3D LiDAR navigation solution for autonomous robots
Coretronic Intelligent Robotics has developed a navigation solution based on 3D LiDAR SLAM (simultaneous localization and mapping) technology for autonomous mobile robots, according...
Thursday 20 August 2020
PSMC launches 3D WoW production for AI memory chips
Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...
Tuesday 18 August 2020
Samsung announces silicon-proven 3D IC technology
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Friday 14 August 2020
Xintec sees 12-inch wafer probing as new growth driver
Taiwan-based CIS and 3D sensor packaging specialist Xintec has kicked off volume production at its newly-installed 12-inch wafer probing lines since July, and expects the new business...
Monday 10 August 2020
Himax expects about 20% sales growth in 3Q20
Display driver IC specialist Himax Technologies expects to post an around 20% revenue increase sequentially in the third quarter of 2020, with flat growth or a slight decrease in...
Thursday 6 August 2020
O-film profits surge in 1H20
China-based camera module maker O-film Tech has reported net profit of CNY360 million (US$51.9 million) for second-quarter 2020, up 156% sequentially and 30.1% on year, driven by...
Wednesday 22 July 2020
KLA intros electron-beam defect inspection system
KLA has announced the eSL10 e-beam patterned-wafer defect inspection system, which is designed to accelerate time-to-market for high-performance logic and memory chips, including...
Monday 6 July 2020
TSMC may commercialize InFO_SoW for supercomputer AI chips in two years
TSMC, after launching 3D SoIC backend service, has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips and is expected to enter commercial...