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NEWS TAGGED 3D
Thursday 2 July 2020
China top-3 OSAT firms to see combined revenues rise 8% in 2020, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics - are expected to see their combined revenues increase...
Wednesday 1 July 2020
ASML, TSMC, Intel tout EUV, advanced packaging at CSTIC 2020
Whenever Moore's Law has seemingly reached its physical limits, there have been always new tech innovations emerging to break the limits, with EUV process and advanced packaging technology...
Thursday 18 June 2020
Highlights of the day: Intel, TSMC head to head in 3D packaging
Intel and TSMC are head to head in 3D packaging technology. While Intel has unveiled its Lakefield processors 3D-packaged...
Thursday 18 June 2020
Intel, TSMC gearing up for heterogeneous 3D IC integration
Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...
Thursday 18 June 2020
China, Taiwan IC designers keen on developing OLED DDI chips
Fabless chipmakers in Taiwan and China specializing in display driver ICs and fingerprint sensor chips are keenly developing OLED DDI chip solutions for smartphones seeking to build...
Tuesday 9 June 2020
Growing optical sensor applications to benefit Taiwan supply chain players
As optical sensors are increasingly applied to wearable devices, TWS (true wireless stereo) earphones, AR/VR headsets and healthcare devices, Taiwan's IC designers, III-V semiconductor...
Thursday 28 May 2020
Macronix to start sampling 48-layer 3D NAND chips in 3Q20
Macronix International expects to start delivering 48-layer 3D NAND flash chip samples to its customers in the third quarter of 2020, followed by volume production later this year.
Wednesday 27 May 2020
Altek supplies 3D depth-sensing lens modules for XRSpace Mova
Digital camera ODM Altek will supply 3D depth-sensing lens modules for use in XRSpace Mova, a 5G-based standalone VR device that XRSpace unveiled on May 26, with shipments to begin...
Wednesday 20 May 2020
FET finishes POC for drone-based 5G 3D spatial network optimization
Far EasTone Telecommunications (FET) has disclosed it has completed proof of concept (POC) for drone-based 5G 3D spatial network optimization, a project intended to optimize spatial...
Friday 15 May 2020
Micron delivers client NVMe performance and value SSDs with QLC NAND
Micron Technology has announced new client solid-state drives (SSD) that bring NVMe performance to client computing applications, freeing laptops, workstations and other portables...
Friday 8 May 2020
Macronix to start shipping 3D NAND chips in 2H20
Macronix International is gearing up to ship its in-house developed 3D NAND memory starting the second half of 2020, according to company chairman Miin Wu.
Friday 8 May 2020
Phison announces support for YMTC 3D NAND flash memory
Flash memory device controller supplier Phison Electronics has announced its support for Yangtze Memory Technologies' (YMTC) 3D NAND flash memory.
Monday 20 April 2020
Qualcomm and BOE to jointly develop display products featuring 3D ultrasonic sensors
Qualcomm Technologies and BOE Technology Group have announced plans to establish a strategic collaboration to develop display products featuring Qualcomm 3D Sonic ultrasonic fingerprint...
Tuesday 14 April 2020
Taiwan CIS, 3D sensor packagers see revenues rally on strong demand
CMOS image sensor (CIS) devices have seen a rapid surge in demand for security surveillance and video conferencing applications due to lockdowns amid the coronavirus pandemic. This,...
Tuesday 14 April 2020
Yangtze Memory intros 128-layer 1.33Tb QLC 3D NAND
Yangtze Memory Technologies (YMTC) has announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform through co-working...