中文網
Taipei
Sun, Aug 1, 2021
08:16
light rain with thunder
27°C
CONNECT WITH US
NEWS TAGGED APPLE
Monday 28 June 2021
Apple starts pulling in component orders for new iPhones
Apple has started pulling in shipments of passive components needed for the production of its next-generation iPhone devices slated for launch in the latter half of 2021, according...
Monday 28 June 2021
Apple sees increasing shipments in India
Apple became the fifth largest PC brand in India in the first quarter of 2021, with shipments of desktops, notebooks, tablets and workstations combined to reach 208,000 units, according...
Friday 25 June 2021
IC substrate makers see supply stay tight despite cryptomining slowdown
IC substrate makers continue to see their output fall short of demand, despite a recent slowdown in cryptomining demand, according to industry sources.
Friday 25 June 2021
Zhen Ding, Flexium enjoy strong Apple orders for antenna modules
Taiwan-based flexible PCB specialists Zhen Ding Technology and Flexium Interconnect will both see revenues generated from antenna modules shipments for Apple devices grow substantially...
Friday 25 June 2021
Qualcomm captures 70% share in 5G basebands in 1Q21, says Strategy Analytics
The global cellular baseband market posted a solid double-digit shipment and revenue growth on the strength of 5G in the first quarter of 2021, according to Strategy Analytics.
Thursday 24 June 2021
ASP of SLP mainboards for new iPhones to stay flat
PCB makers in the supply chain of iPhones are expected to see only limited growth in ASPs this year due to insignificant specs upgrades in SLP (substrate-like PCB) mainboards for...
Thursday 24 June 2021
BT substrate suppliers kicking off shipments for new Apple devices
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
Thursday 24 June 2021
New Apple Watch reportedly to adopt double-sided SiP for PMICs
The upcoming Apple Watch series reportedly will massively adopt double-sided SiP packaging for power management ICs, with ASE Technology as the main backend partner, according to...
Tuesday 22 June 2021
Uneven chip inventories challenging downstream device assemblers
Uneven inventories across chipmakers are generating more costs facing downstream device assemblers in not only the PC and handset sectors but also the auto industry, according to...
Tuesday 22 June 2021
TSMC to give top priority to car chips, Apple orders
TSMC will give supply priorities to orders for automotive ICs and those placed by Apple in the third quarter of 2021, followed by chip orders for PCs, servers and networking devices,...
Monday 21 June 2021
Smartphone components to see orders from Apple rise in 2H21
China's smartphone demand failed to gain as much momentum as expected during the Labor Day holidays, resulting in declines in smartphone component shipments in the second quarter,...
Friday 18 June 2021
Intel notebook CPU market share may fall to new low in 2022
Intel may see its notebook processor market share drop to a record low in 2022, according to market sources.
Thursday 17 June 2021
FiTech upbeat about demand for miniLED-backlit devices
LED probing, testing and sorting equipment maker FiTech is ramping up its OEM testing and sorting capacity for miniLED chips, having recently completed the corresponding capacity...
Wednesday 16 June 2021
Taiflex, AEM to build new FCCL capacity for smartphone clients
Taiwan-based Taiflex Scientific and Asia Electronic Material (AEM), dedicated to supplying FCCL and other flexible PCB materials, both plan to build additional production lines to...
Wednesday 16 June 2021
Zhen Ding, Flexium see strong 2Q21 on non-handset FPCB shipments
Taiwan's flexible PCB (FPCB) suppliers Zhen Ding Technology and Flexium Interconnect are expected to post robust sales for second-quarter 2021, mainly bolstered by shipments to Apple...