Apple's demand for 5nm A14 mobile application processors (AP) to support its 5G devices is likely to be 50-60% higher than that for its 7nm A13, highlighting the vendor's determination...

Taiwan's leading backend service provider ASE Technology Holding expects to register an average capacity utilization of 75-80% for the first quarter of 2020 and is optimistic that...

Taiwan's IC backend service firms are optimistic that 5G base station chips demand from China will stay strong in the mid to long term despite uncertainty about when the coronavirus...

Taiwan-based backend houses including ASE, KYEC and SPIL have instructed their employees not to make non-essential business travels to China, as part of their precautions to mitigate...

Despite global automotive semiconductor market being dominated by IDMs in Europe, the US and Japan, Taiwan's backend service leader ASE Technology Holding has been strengthening its...

Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...

Taiwan-based Filtrafine, which provides filtration and purification solutions for industries demanding chemical wastewater and gas treatment, is eyeing a bigger presence in the chipmaking...

Taiwan's backend service provider ASE reportedly will be packaging mmWave 5G antenna modules for Apple's products to be launched this year. The iPad is said to be in Apple's...

Taiwan's backend leader Advanced Semiconductor Engineering (ASE) has reportedly broken into the supply chain for Apple's mmWave 5G iPhones and 5G iPads with its substrate-based FC_AiP...

Nepcon Japan 2020 runs from January 15-17 in Tokyo with exhibitors showcasing their latest IC innovations covering packaging technologies, materials, equipment, sensors and PCBs for...

Ansys has increased its R&D workforce in Taiwan by 50% to support its local chipmaking partners, according to Roger Lee, company country manager for Taiwan.

ASE Technology Holding is expected to see its core IC assembly, testing and material (ATM) business register flat sequential revenue growth in the first quarter of 2020, thanks to...

TSMC's backend antenna-in-package technology, dubbed InFO-AiP, has attracted orders from US-based clients for packaging 5G mmWave devices, with volume production set to kick off next...

IC assembly and test services provider ASE Technology Holding has signed a MoU with Taiwan's STSP (Southern Taiwan Science Park) Bureau to secure 20 hectares of land at a new national...

ASE Technology and VisEra Technologies are both being pinpointed as among the backend houses set to enjoy robust demand for optical in-display fingerprint sensors, according to industry...

Chinese chipmakers are revving up development of HPC (high performance computing) chips for AI and deep learning applications, which are expected to become available for volume production...

ASE Technology Holding COO Tien Wu, commenting on his experience in constructing lights-out factories, has pointed out that in order for such facilities to succeed, it requires clients'...

While China's homegrown processor makers are gearing up to develop new-generation solutions to serve huge domestic PC replacement demand, Taiwan-based Unimicron Technology and Nan...

Chip demand for PCs from China will pick up substantially in 2020 due to large-scale replacement of PCs by the government and military sectors, providing huge business opportunities...

Universal Scientific Industrial (USI), a member of Taiwan's ASE Technology Holding, has disclosed plans to acquire fellow EMS company Asteelflash for around US$450 million.

Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...

Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...

As shipments of midrange 5G smartphones are expected to expand significantly in 2020, the resultant strong demand for chipsets will be a major revenue growth driver for Taiwan's backend...

MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from...

System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...