中文網
Taipei
Thu, Jun 30, 2022
14:46
mostly clear
32°C
CONNECT WITH US
NEWS TAGGED ASE
Monday 27 June 2022
ASE connects ESG standards and frameworks dots
Sustainability reporting is constantly evolving. The foundations of environmental, social, and governance (ESG) are grounded on Socially Responsible Investing (SRI) and built up to...
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Friday 24 June 2022
ASE Technology obtains orders for EV charging piles
ASE Technology has obtained packaging orders for power modules used in electric vehicle (EV) charging piles while enjoying a ramp-up in orders for automotive microcontroller units...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Tuesday 21 June 2022
Automotive MCU supply to stay tight through 2H23
The supply of automotive MCUs is expected to stay tight through the second half of 2023, according to industry sources.
Monday 20 June 2022
Taiwan backend partners gear up for new AMD, Nvidia HPC chips
Leading CPU and GPU vendors AMD and Nvidia are all set to commercialize brand-new CPU and GPU platforms in 2023, and their backend partners in Taiwan are all gearing up to give full...
Wednesday 15 June 2022
Top-3 game console vendors show mixed sales amid chip shortages
The world's three leading game console vendors Sony, Nintendo and Microsoft have shown mixed sales results amid the supply crunch of some basic chips and components.
Wednesday 15 June 2022
IC packaging materials demand remains strong
Demand for BT substrates, aQFN leadframes and other IC packaging materials continues ramping up, thanks to robust demand for network chips and devices, according to industry source...
Friday 10 June 2022
ASE gearing up for server, HPC chip boom
ASE Technology with its advanced packaging capability is eyeing a bigger presence in the field of server and network chips, and expects to post revenue growth in 2022.
Wednesday 8 June 2022
ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Tuesday 7 June 2022
Taiwan-based IC testing firms maintain positive outlook for 2022
Taiwan-based IC testing firms expect to enjoy strong demand for high-end testing driven by network chips, high-performance computing (HPC) solutions, power management ICs (PMIC),...
Thursday 2 June 2022
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Wednesday 1 June 2022
Arm-based HPC chips gain ground for PCs, benefiting OSATs
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...