Sustainability reporting is constantly evolving. The foundations of environmental, social, and governance (ESG) are grounded on Socially Responsible Investing (SRI) and built up to...
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
ASE Technology has obtained packaging orders for power modules used in electric vehicle (EV) charging piles while enjoying a ramp-up in orders for automotive microcontroller units...
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Leading CPU and GPU vendors AMD and Nvidia are all set to commercialize brand-new CPU and GPU platforms in 2023, and their backend partners in Taiwan are all gearing up to give full...
The world's three leading game console vendors Sony, Nintendo and Microsoft have shown mixed sales results amid the supply crunch of some basic chips and components.
Demand for BT substrates, aQFN leadframes and other IC packaging materials continues ramping up, thanks to robust demand for network chips and devices, according to industry source...
ASE Technology with its advanced packaging capability is eyeing a bigger presence in the field of server and network chips, and expects to post revenue growth in 2022.
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Taiwan-based IC testing firms expect to enjoy strong demand for high-end testing driven by network chips, high-performance computing (HPC) solutions, power management ICs (PMIC),...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
