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NEWS TAGGED AUTOMOTIVE
Wednesday 18 May 2022
Everlight expects automotive miniLED BLU shipments to rise in 2H22
LED chipmaker Everlight Electronics expects shipments of its miniLED backlight units (BLU) for automotive displays to rise in the second half of 2022, when its Taiwan production capacity...
Tuesday 17 May 2022
Actron, Eris eyeing IDM-like operations for car, industrial power devices
Taiwan-based power semiconductor suppliers including Actron Technology and Eris Technology are aggressively utilizing manufacturing and supply-chain resources from their affiliated...
Tuesday 17 May 2022
Renesas intros automotive ECU virtualization solution platform
Renesas Electronics has announced an integrated automotive ECU virtualization platform that enables designers to integrate multiple applications into a single ECU that are safely...
Monday 16 May 2022
Taiwan OSATs embracing more car, industrial IC orders from IDMs
International IDMs including Infineon and STMicroelectronics continue stepping up production of automotive, industrial control and networking chips to meet ever-rising demand, outsourcing...
Monday 16 May 2022
Novatek, Realtek eyeing more foundry capacity for non-consumer chips
Taiwan's first-tier IC design houses Novatek Microelectronics and Realtek Semiconductor are seeking more capacity support from foundry partners TSMC and UMC to fulfill new orders...
Friday 13 May 2022
Japan MLCC makers see strong demand from emerging industries
Japan-based multi-layer ceramic capacitor (MLCC) suppliers are seeing robust demand from emerging industries, such as 5G, AIoT, and future vehicles, according to industry sources.
Friday 13 May 2022
GTA steps up purchases of China homegrown fab tools
Shanghai-based analog chips foundry GTA Semiconductor has stepped up purchases from Naura Technology, ACM Research and other China-based semiconductor equipment makers to carry out...
Friday 13 May 2022
TDK to build new factory for automotive MLCCs
TDK has announced plans to construct a new factory building at its manufacturing site in Kitakami, Japan's Iwate Prefecture, for automotive MLCCs. Construction of the factory is scheduled...
Thursday 12 May 2022
Most vehicles today are not developed with cybersecurity in mind, says Cybellum
Electric vehicles (EVs) are at the center of the world's push toward a decarbonized future, and the importance of cybersecurity in the automotive domain is without question.
Thursday 12 May 2022
Analog IC firm GMT cautious about 2Q22
Global Mixed-mode Technology (GMT), a fabless supplier of analog and power management ICs, has expressed caution about its operations in the second quarter of 2022 citing growing...
Thursday 12 May 2022
IC design houses under pressure to drop prices
IC design houses, particularly those specializing in chips for handsets and other mass-market device applications, are under pressure to lower their prices amid sluggish end-market...
Wednesday 11 May 2022
MOSFET maker Force-MOS posts record April revenue
Taiwan's MOSFET supplier Force-MOS Technology saw its April revenue hit a record high for the fourth consecutive month, as tight supply of MOSFET chips remains despite a slowdown...
Wednesday 11 May 2022
Yen Sun sees no cutback in China orders for car cooling fans
Automotive cooling fan supplier Yen Sun Technology has seen no cutback in orders from the China market despite chip shortages and COVID lockdowns in Shanghai and other major Chinese...
Tuesday 10 May 2022
DDI makers to see 3Q22 shipments boosted by car, specialty applications
Display driver IC (DDI) demand for handsets and other consumer devices has been sluggish and market prospects remain uncertain for the third quarter, prompting DDI makers to switch...
Tuesday 10 May 2022
Automotive IDMs enjoy high order visibility
Automotive electronics supplier On Semiconductor (Onsemi) has stopped taking orders for insulated gate bipolar transistors (IGBTs) at its Shenzhen plant, but some orders might be...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.