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Friday 30 July 2021
GIS expects fingerprint sensor modules to drive future growth
Touch panel specialist General Interface Solution (GIS) expects sales of its fingerprint recognition solutions to climb as a proportion of company revenue to 20-30% in 2023 and 2024,...
Friday 30 July 2021
Primax expects acoustic components sales to drive 3Q21 growth
Primax Electronics has expressed optimism about its operations in the third quarter of 2021, citing robust growth of its acoustic components sales.
Thursday 29 July 2021
China MOSFET suppliers to raise prices in 4Q21
China-based MOSFET specialists including China Resources Microelectronics (CR Micro), Yangjie Electronic Technology and NCE Power are poised to raise their quotes again in the fourth...
Tuesday 27 July 2021
Yageo optimistic about 3Q21
Passive component vendor Yageo has expressed optimism about its operations in the third quarter of 2021, citing stable growth in demand for automotive and industrial applications.
Monday 26 July 2021
Automotive lighting module suppliers EOI, Laster see 2Q21 sales rebound
Although the supply of automotive chips in the second half of the year remains slow and the overall shortage of materials continues to affect future shipment, the automotive lighting...
Monday 26 July 2021
IC materials distributor CWE to transform into manufacturer
Chang Wah Electomaterials (CWE), after building a solid presence in the distribution of semiconductor materials, is on track to transform into a manufacturer of diverse materials...
Monday 26 July 2021
PCB shipments for high-end car applications to rise notably in 2H21
Taiwan's automotive PCB makers are expected to significantly ramp up their shipments in the second half of the year as car chip shortages are improving along with a notable surge...
Monday 26 July 2021
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
Friday 23 July 2021
CWTC to embrace five golden years for leadframe sales
Taiwan's leading leadframe maker Chang Wah Technology (CWTC) is set to enjoy five golden years duing which supply will continue to fall short of demand, according to company chairman...
Friday 23 July 2021
Automotive IC IDMs in talks with OSATs about demand in 2022
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
Friday 23 July 2021
Foundries gearing up for robust automotive IC demand
Taiwan-based pure-play foundries including TSMC, United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) are all...
Friday 23 July 2021
TSMC ramping up output for automotive chips
TSMC will be ramping up its output for automotive chips through 2022, as the foundry has struck multiple contracts set to be fulfilled next year, according to sources at fabless ch...
Friday 23 July 2021
Strong demand for panels boosts Taiwan optoelectronics industry
Taiwan's optoelectronics industry in the first half of 2021 shows strong growth, compared to the same period in 2020, due to the large-scale stimulus plans from major economies and...
Thursday 22 July 2021
Apple, carmakers vying for more ICs
Apple has stepped up its chip purchases for the upcoming iPhones, while first-tier automotive component vendors in the supply chains of carmakers in Japan are also vying for more...
Thursday 22 July 2021
Taiwan to form car tech association
Several Taiwan-based ICT makers and associations will participate in establishing Taiwan Advanced Automotive Technology Development Association (TADA) soon, according to the initiator...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.