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NEWS TAGGED AUTOMOTIVE
Monday 25 October 2021
OSATs to see strong backend orders for car-use MCUs in 2022-2023
International IDMs are set to raise quotes for automotive MCUs in 2022, and their backend partners in Taiwan are all expected to sustain robust backend momentum through 2022-2023...
Friday 22 October 2021
China automaker Geely considers developing ICs in-house
China's Geely Automobile Holdings is reportedly mulling in-house development and production of chipsets for its own vehicles as it has newly expanded its registered businesses to...
Thursday 21 October 2021
Highlights of the day: Automotive chip prices set to rise
Automotive IDMs have already told their clients that their chip prices will go up by 10-20% starting 2022 amid rising...
Thursday 21 October 2021
ASML gearing up for EUV equipment boom
With Intel announcing plans to adopt ASML's high-NA EUV machines in its post-nanometer process technology that is expected to be ready for production by 2025, ASML has disclosed it...
Thursday 21 October 2021
IC design houses see clients increasingly reluctant to accept price hikes
Taiwan-based IC design houses, particularly those engaged in consumer ICs, have come under increasing pressure to maintain their quotes for 2022 as customers are more reluctant to...
Thursday 21 October 2021
Automotive IDMs to raise chip prices by 10-20% in 2022
Automotive IDMs have notified their clients about 10-20% price hikes for their chips starting 2022 as they continue to face mounting costs for raw materials, according to industry...
Wednesday 20 October 2021
Taiwan PCB equipment suppliers busy fulfilling orders
With PCB and IC substrate suppliers looking to expand capacity, related equipment suppliers will be busy fulfilling orders that will be ramping up substantially through 2022, according...
Tuesday 19 October 2021
Foxconn to promote localized EV production for regional markets
Foxconn Technology (Hon Hai) is well prepared to leverage its software and semiconductor prowess to turn out more EVs with high performance and intelligence in 2022/2023, and will...
Tuesday 19 October 2021
IC design houses join Foxconn EV ecosystem
Taiwan-based semiconductor suppliers MediaTek, Novatek, Realtek, Sunplus, ITE Tech, PixArt Imaging, Weltrend, Fitipower, NOVA, and Nuvoton have joined the Foxconn-led EV consortium,...
Monday 18 October 2021
Chipmakers cautious about overbooking for consumer applications in 4Q21
Shipments of display driver ICs (DDI) for Chromebook and large-size TV applications are apparently slowing down on seasonality in the fourth quarter, but the supply of networking...
Monday 18 October 2021
IDMs, chipmakers on track to raise automotive MCU output
International IDMs and chipmakers are set to ramp up their output for automotive MCUs in the next few years to meet ever-growing demand for such chips, according to industry source...
Friday 15 October 2021
Highlights of the day: Automotive IC shortages to remain
The car industry has been plagued by component shortages, and automotive IC shortages are likely to last till at least...
Friday 15 October 2021
Chip shortage causes uneven inventories, says Acer chairman
Notebook inventories held by Acer's channel distributors are pretty low. The PC vendor still has a large backlog of orders from international distributors as uneven inventories across...
Friday 15 October 2021
Automotive IC shortage to persist for next 2-3 years
The global shortage of automotive ICs is likely to last beyond next year until 2023 or even 2024, and automakers worldwide are trying all possible means to counter, according to industry...
Friday 15 October 2021
Will foundry expansions lead to capacity glut?
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.