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NEWS TAGGED BGA
Friday 7 January 2011
Nanya PCB to slash capex in 2011
Nanya PCB (NPC) plans to drop its capital spending from NT$5 billion (US$171 million) in 2010 to less than NT$1 billion in 2011, as most of its investment for expanding capacity for...
Tuesday 9 March 2010
PTI seeking clarity on ITC ruling in Tessera DRAM case
Despite receiving a favorable ruling in a US International Trade Commission (ITC) over a patent infringement lawsuit brought by Tessera, memory packaging and testing service provider...
Wednesday 10 February 2010
Solder material supplier Shenmao enjoys sequential revenue growth in January
Shenmao Technology, a solder bumping paste supplier, has announced consolidated revenues for January 2010 grew 8.27% sequentially and 132.06% on year to NT$534 million (US$17 million)...
Thursday 24 December 2009
ChipMOS loses DRAM packaging patent lawsuit against Walton
Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...
Thursday 19 November 2009
Solder material maker Shenmao expects revenues in 2010 to grow 20% on year
Taiwan-based solder material maker Shenmao Technology expects its revenues in 2010 to grow 20% and reach a record high compared to 2009.
Thursday 8 October 2009
Solder sphere maker Shenmao sees revenues hit year-high in September
Taiwan-based ball-grid array (BGA) solder sphere maker Shenmao Technology saw its consolidated revenues increase 6.4% sequentially to hit a year-high of NT$575 million (US$17.86 million)...
Friday 11 September 2009
Shenmao expands BGA solder sphere capacity by 70%
Shenmao Technology has expanded its production capacity of ball-grid array (BGA) solder spheres, its main product line, by 70% to meet orders from new clients, according to the com...
Wednesday 12 August 2009
AMD adds new dual-core CPUs to embedded BGA client platform
AMD has announced immediate availability of two new dual-core, 18W TDP processors for the scalable ASB1 BGA embedded client platform, the Turion Neo X2 processor Model L625 and the...
Wednesday 24 June 2009
Nanya PCB expects strong 2H09 on CE demand
Nan Ya Printed Circuit Board (NPC) has forecast its revenue ratio between the first and second halves of 2009 may be between 30:70 and 40:60, according to company president Otto Chang...
Tuesday 19 May 2009
KYEC 3Q09 sales may grow by double-digits, says CEO
IC testing house King Yuan Electronics Company (KYEC) stands a good chance of enjoying double-digit sales growth sequentially in the third quarter of 2009, thanks to improved order...
Tuesday 12 May 2009
Solder paste supplier Shenmao expected to see 40-50% revenue growth in 2Q09
Shenmao Technology is optimistic about its second-quarter outlook, and market watchers expect its revenues to grow 40-50% in the quarter, with strong sales of solder paste and ball-grid...
Monday 30 March 2009
Material supplier Shenmao adds two customers for BGA solder spheres
Material supplier Shenmao Technology received orders for ball-grid array (BGA) solder spheres from two connector customers earlier in March and will begin volume shipments in April,...