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NEWS TAGGED BUMPING
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Friday 25 June 2021
PTI obtains new bumping orders for logic chips
Memory backend specialist Powertech Technology (PTI) has recently obtained wafer bumping orders for networking chips from Broadcom and MediaTek, indicating a significant payoff in...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Thursday 29 April 2021
ASE raises capex projection for 2021
Taiwan's leading OSAT firm ASE Technology Holding will raise its capex budget by 10-15% to up to US$2 billion for 2021, from the previous estimation of US$1.7 billion, according to...
Wednesday 28 April 2021
PTI to further expand DRAM backend capacity
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Tuesday 23 March 2021
PTI to offer Renesas additional backend capacity support
Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...
Wednesday 27 January 2021
PTI set to boost logic IC backend revenue ratio to 50% in mid-2021
Memory backend specialist Powertech Technology (PTI) is gearing up to expand its business in the logic IC field in 2021 with focus placed on flip-chip packaging and bumping services,...
Thursday 7 January 2021
OSE seeking logic chips backend orders after allying with Chipbond
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Friday 4 December 2020
Chipbond to expand backend capacity for RF, PA devices, driver ICs
Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.
Monday 26 October 2020
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Friday 23 October 2020
PTI to gear up logic IC backend business expansion
Backend house Powertech Technology (PTI) will step up efforts to expand its logic IC business, aiming to boost the revenue ratio for the segment from nearly 30% to over 40%, according...
Tuesday 20 October 2020
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Tuesday 11 August 2020
Backend demand for consumer logic chips picking up
Taiwan-based IC backend houses including ASE Technology and Powertech Technology (PTI) have seen orders placed by game console and other consumer electronics vendors ramp up since...
Friday 17 July 2020
Top China backend firms gaining significant expansion momentum
China's top-3 backend houses JCET, Huatian Technology and Tongfu Microelectronics, now all among the world's top-10 IC assembly and testing firms, are gaining increasing business...