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NEWS TAGGED BUMPING
Friday 17 July 2020
Top China backend firms gaining significant expansion momentum
China's top-3 backend houses JCET, Huatian Technology and Tongfu Microelectronics, now all among the world's top-10 IC assembly and testing firms, are gaining increasing business...
Monday 18 May 2020
TSMC may move mature CoWoS tech to US fab, say sources
As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
Friday 3 January 2020
SJSemi strengthens presence in wafer-level 3D packaging segment
SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
Thursday 24 October 2019
China IC backend firms poised for strong 2020
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
Wednesday 31 July 2019
JCET kicks off 12-inch wafer bumping production in S Korea
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
Wednesday 20 March 2019
SJSemi rolls out AiP technology for 5G and millimeter waves
SJ Semiconductor (SJSemi) has unveiled its ultrawideband dual-polarization antenna-in-package (AiP) technology for 5G millimeter-wave applications.
Thursday 26 July 2018
China IC packager Tongfu sets up new fab in Xiamen
As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation...
Wednesday 25 April 2018
SPIL 1Q18 profits fall to 9-quarter low
IC packaging specialist Siliconware Precision Industries (SPIL) has reported net profits of NT$240 million (US$8.1 million) for the first quarter of 2018, down 83.9% sequentially...
Friday 9 February 2018
SPIL spends NT$710 million on equipment for China subsidiary
IC packager Siliconware Precision Industries (SPIL) has disclosed it has spent a total of NT$710.71 million (US$24.3 million) on equipment from Kulicke and Soffa Industries for its...
Friday 2 February 2018
ASE expects revenues to pick up starting 2Q18
Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...
Wednesday 31 January 2018
Logic IC packager Greatek upbeat about revenues for 2018
After scoring impressive revenue and profit records in 2017, Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI) , is quite optimistic...
Tuesday 30 January 2018
Taiwan IC packagers to cash in on mining craze in 2018
Taiwan IC backend service providers including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYE), are upbeat about their...
Monday 29 January 2018
SPIL posts EPS of NT$2.21 for 2017
IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits fall 30.5% on year to NT$6.9 billion (US$237 million) in 2017. EPS for the year came to NT$2.21...
Wednesday 17 January 2018
ChipMOS lands orders from new clients for gold bumping services
Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...
Tuesday 5 December 2017
Backend IC service provider Sigurd sees bright prospect in 2018
Taiwan-based IC packaging and testing house Sigurd Microelectronics is expected to enjoy strong revenue performance in 2018 due to more orders from Amazon for its smart speaker chips,...