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Thursday 17 September 2015
SMIC, China National Fund and Qualcomm sign letter of intent to invest in SJsemi
Semiconductor Manufacturing International (SMIC) announced on September 16 that the company has signed a letter of intent with China Integrated Circuit Industry Investment Fund (CICIIF)...
Wednesday 29 July 2015
Chipbond to boost sales from non-driver ICs, says report
Chipbond Technology, which provides backend services mainly for LCD driver ICs, will see significant growth in sales from its non-driver IC product line in the second half of 2015,...
Monday 10 November 2014
TI to open 300mm wafer bumping facility in Chengdu
Texas Instruments has announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu...
Friday 2 May 2014
PTI to acquire Nepes in Singapore
Powertec Technology (PTI) announced on April 29 that it has entered into a share purchase agreement with Nepes to acquire Nepes Pte Ltd (NPL) in Singapore.
Thursday 13 March 2014
China IC backend service companies migrating to advanced processes
More IC testing and packaging companies in China are expected to migrate to advanced processes following Semiconductor Manufacturing International Corporation (SMIC) and Jiangsu Changjiang...
Friday 21 February 2014
SMIC, JCET form JV for 12-inch bumping and testing
Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...
Tuesday 31 December 2013
SPIL looks to strong performance in 4Q13 and 1Q14
Siliconware Precision Industries (SPIL) is expected to perform better than expected in the fourth quarter of 2013 and the first quarter of 2014 as the IC backend service firm has...
Tuesday 31 December 2013
IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
Monday 16 December 2013
TSMC adjusting capacity to meet rising orders for bumping services
TSMC expects its in-house capacity for wafer bumping services will fail to satisfy customer demand, and plans to outsource more orders for 8-inch wafers for use in the manufacture...
Friday 13 December 2013
ASE likely to lose orders as plants might shut down over toxic leaks
One or more factories of Taiwan-based Advanced Semiconductor Engineering (ASE), the world's largest IC packaging house, might receive a government order to suspend operations for...
Thursday 12 December 2013
TSMC builds up bumping capacity
Taiwan Semiconductor Manufacturing Company (TSMC) has built up its bumping capacity to 150,000 12-inch wafers a month with total shipments amounting to over five million units, according...
Tuesday 11 September 2012
Chipbond 12-inch gold bumping lines to operate at full capacity in September
LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...
Tuesday 21 August 2012
Chipbond 3Q12 sales driven by demand for small-size panel driver ICs
Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...
Friday 29 June 2012
Chipbond gold bumping capacity booked for iPhones, says report
Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...
Monday 4 June 2012
Chipbond lands 8-inch gold bumping orders from Samsung, says paper
LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...