Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according...

Taiwan-based IC substrate makers Unimcron, Na Ya PCB and Kinsus Interconnect Technology are actively proceeding with capacity expansions for ABF substrates in 2020 to meet robust...

Taiwan-based ODM Inventec expects each of its three major product lines to register about 10% revenue expansion in 2020 and a higher growth in 2021, with plans to simultaneously expand...

Wistron chairman Simon Lin expects the company's results in 2020 to be better than in 2019 because business re-organization last year brought limited change to the company's revenue...

Despite a truce in the US-China trade war, notebook ODMs will continue their capacity relocation to Taiwan and Vietnam, with the two becoming their major production bases outside...

PCB maker Compeq Manufacturing saw its revenues for 2019 rise 10.52% on year to a record high of NT$56.17 billion (US$1.87 billion) thanks to strong demand from the segments of handsets...

IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...

GaAs IC foundry Win Semiconductors and Visual Photonics Epitaxy Company (VPEC), which manufactures epitaxial wafers, both saw revenues increase by over 20% in 2019 and are expected...

Major NAND flash makers including Samsung and Kioxia (formerly Toshiba Memory) have had their capacity expansion projects proceed at a gradual pace, with new capacities set to come...

Taiwan IC substrate makers will have no time to lose in expanding their ABF substrate capacities as demand for such substrates will grow substantially in 2020 and beyond along with...

Global SOI (silicon on insulator) market scale is expected to double by 2024 from 2019 thanks to significant expansion in applications to mobile devices, communication infrastructure,...

Taiwan-based testing house King Yuan Electronics (KYEC) is expected to see its first-quarter 2020 revenues hit the highest record ever for the same quarter with monthly revenues to...

China's overall IC production capacity will continue to expand in 2020 as both IDMs and foundry houses there have readied expansion plans covering 4-, 6-, 8- and 12-inch wafer fabs...

China-based DRAM startup ChangXin Memory Technologies (CXMT) is making progress in the development of LPDDR4x memory chips, which will initially attract orders from China's second-tier...

IC assembly and test services provider ASE Technology Holding has signed a MoU with Taiwan's STSP (Southern Taiwan Science Park) Bureau to secure 20 hectares of land at a new national...

As much as 17.9 million wafers (200mm-equivalents) per year of new IC capacity could be added in 2020, followed by another 20.8 million wafers of new IC capacity in 2021, which would...

Samsung Electronics and China's Yangtze Memory Technology (YMTC) have both stepped up equipment purchases for building additional new NAND flash fabrication lines since the second...

Taiwan-based HDI PCB manufacturers have put increased focus on non-handset applications to improve product portfolios, which is expected to drive up their quotes and profitability...

Taiwan-based PCB maker Compeq Manufacturing is expected to see strong shipment momentum for handset-use HDI boards and True Wireless Stereo (TWS) earbud-use rigid-flex boards that...

Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...

HDI PCB specialist Tripod Technology is on track to meet its revenue target of NT$54 billion (US$1.77 billion) for 2019, a new high compared to the previous record of NT$52.1 billion...

With capital expenses by semiconductor firms in Taiwan and China set to regain expansion momentum in 2020, equipment supply chain players are expected to see a bright year for their...

Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...

TSMC is firmly on track to move 5nm process technology to commercial production in the first half of 2020 and will kick off production of chips built using a newer 3nm process node...

BOE Technology and China Star Optoelectronics Technology (CSOT) have both disclosed plans to stop their investments in LCD display technology development and capacity expansion.