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NEWS TAGGED CHIPMOS
Wednesday 13 October 2021
DDI backend firms expect flat growth in 4Q21
Taiwan-based display driver IC (DDI) backend specialists expect to post flat sequential revenue growth in the fourth quarter of 2021, as tight foundry capacity constrains their fabless...
Monday 4 October 2021
Backend demand for commodity DRAM falls slightly in 4Q21
Backend service demand for commodity DRAM has dropped slightly, while that for NAND flash for enterprise SSDs and NOR flash for niche applications will stay relatively stable in the...
Friday 24 September 2021
DDI backend firms to enhance advanced testing capacity
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are looking to enhance their high-end testing capability, eyeing promising growth in demand for...
Tuesday 14 September 2021
DDI backend houses to strengthen high-end testing capacity expansions in 2022
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Wednesday 11 August 2021
ChipMOS sees lucrative memory backend prospect for 2H21
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
Tuesday 3 August 2021
COF substrate, probe card demand stays robust for processing DDI chips
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Monday 2 August 2021
DDI backend quotes trending upward
Display driver IC (DDI) backend quotes will be rising again in the third quarter of 2021 to reflect supply-side constraints, according to industry sources.
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Friday 16 July 2021
ChipMOS, Chipbond may further raise backend quotes in 2H21
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Monday 5 July 2021
OSATs see significant surge in 2H21 memory backend demand
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Monday 7 June 2021
Taiwan backend houses caught in cluster COVID infections
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Monday 24 May 2021
OSATs may further hike service quotes in 3Q21
Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding...
Wednesday 19 May 2021
Greatek building new backend processing plants
Logic IC backend specialist Greatek Electronics is constructing two new factories, which are set to be completed for commercial runs in 2022, but the company has already seen clients...
Friday 14 May 2021
TSMC, high-tech firms unscathed by massive outage in Taiwan
TSMC and other major high-tech firms in Taiwan have reported little impact from a five-hour rolling power blackout that affected many parts of the country on May 13.
Jun 30, 09:59
DataVan's smart solutions empower retail industry to meet new demand from new normal
Wednesday 29 June 2022
ADATA launches industrial-grade 31C series 112-Layer 3D NAND (BiCS5) solid state drives
Wednesday 29 June 2022
Digitalization as key for transformation to smart manufacturing: ZNT's detailed market approach to further support valued customers in Asia-Pacific region
Wednesday 29 June 2022
UMC climate goals validated by SBTi
Notebook sales to pick up in 3Q22
TSMC sees major clients queue up for 3nm process capacity
GF, SMIC may bear the brunt of consumer chips demand downturn
TSMC to initiate about 6% price hike in 2023
Intel cutting Alder Lake CPU prices to attract order pull-ins from PC brands
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
AIO PC shipment decline to in 2Q22, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – May 2022
Notebook shipments rebound in May with China COVID lockdowns easing, says DIGITIMES Research
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