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NEWS TAGGED CIS
Friday 16 July 2021
Asia Tech Image enjoys CIS module orders visible until 2022
CIS module maker Asia Tech Image has obtained surging orders with their shipments scheduled until 2022, according to company chairman Robert Lai.
Thursday 15 July 2021
Wafer probing houses see order visibility for car chips strenghtened
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Tuesday 29 June 2021
MIH may stretch into autonomous driving
MIH Consortium, a Foxconn-led open EV ecosystem, may extend its business tentacle into the self-driving segment as quite a few startups from the segment are now members of the alliance...
Monday 21 June 2021
Smartphone components to see orders from Apple rise in 2H21
China's smartphone demand failed to gain as much momentum as expected during the Labor Day holidays, resulting in declines in smartphone component shipments in the second quarter,...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Wednesday 9 June 2021
Apple to increase VCM orders starting June for new iPhones
Taiwan-based voice coil motor (VCM) suppliers expect order pull-ins from Apple to gradually turn strong starting from June as the US brand is expected to release its next-generation...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 3 May 2021
TSMC ramping 28nm chip output despite cutback in orders from Sony
Despite weakened orders from Sony, TSMC still has been ramping up its 28nm chip output with plans to build additional production capacity at its Nanjing fab in China, according to...
Monday 26 April 2021
Tong Hsing to raise quotes for ceramic substrates later in 2Q21
Taiwan's backend house Tong Hsing Electronic Industries is set to raise quotes for ceramic substrates later in the second quarter of the year in response to increasingly strong demand...
Friday 9 April 2021
Backend houses see order visibility for CIS, sensor chips through 4Q21
Backend houses continue to enjoy strong demand for processing IP camera chips and CMOS image sensor (CIS) chips, with their order visibility clear through the fourth quarter of 2021,...
Friday 9 April 2021
IC and material distributors to embrace strong profit growth in 2021
Taiwan-based IC and material distributors are expected to see their profit growths this year outperform revenue increases, as shortages of IC parts and materials are sending prices...
Thursday 18 March 2021
Taiwan IC packaging-testing firms eyeing automotive CIS
As international design houses of smartphone-use CMOS image sensors (CIS) including Sony, Samsung Electronics, OmniVision and On Semiconductor have shifted 2021 business focus to...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...