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NEWS TAGGED CIS
Monday 15 November 2021
OSATs for handset 3D sensors, CIS see revenues fall in October
Taiwan-based backend houses Xintec and VisEra, both in the supply chain of 3D sensors for iPhone 13 series, saw their October revenues fall sequentially on a slowdown in shipments...
Monday 25 October 2021
Specialty DRAM, NOR flash supply to remain constrained in 2022
The supply of specialty DRAM and NOR flash memory chips will still fall short of demand in 2022, due to supply-side constraints, according to industry sources.
Tuesday 28 September 2021
Sony tops smartphone CIS market in 1H21, says Strategy Analytics
The global smartphone image sensor market in the first half of 2021 clocked a total revenue of US$7 billion, with Sony capturing a 42% share, according to Strategy Analytics.
Wednesday 8 September 2021
OmniVision to cut back wafer starts at Taiwan foundries, say sources
OmniVision plans to cut back substantially its orders placed with Taiwan's IC manufacturing sector, according to market sources.
Tuesday 24 August 2021
Tong Hsing to open new plant in 2022 for processing car CIS, SiC chips
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has held a beam-raising ceremony for its...
Tuesday 17 August 2021
Backend houses enjoy strong influx of orders for automotive CIS
Taiwan-based backend houses, including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC), and Xintec, have seen orders from international IDMs continue ramping up for...
Friday 13 August 2021
Xintec optimistic about 3Q21
Taiwan-based CIS and 3D sensor packaging specialist Xintec has expressed optimism about its sales performance in the third quarter of 2021, thanks to a seasonal pick-up in demand...
Friday 16 July 2021
Asia Tech Image enjoys CIS module orders visible until 2022
CIS module maker Asia Tech Image has obtained surging orders with their shipments scheduled until 2022, according to company chairman Robert Lai.
Thursday 15 July 2021
Wafer probing houses see order visibility for car chips strenghtened
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Tuesday 29 June 2021
MIH may stretch into autonomous driving
MIH Consortium, a Foxconn-led open EV ecosystem, may extend its business tentacle into the self-driving segment as quite a few startups from the segment are now members of the alliance...
Monday 21 June 2021
Smartphone components to see orders from Apple rise in 2H21
China's smartphone demand failed to gain as much momentum as expected during the Labor Day holidays, resulting in declines in smartphone component shipments in the second quarter,...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Wednesday 9 June 2021
Apple to increase VCM orders starting June for new iPhones
Taiwan-based voice coil motor (VCM) suppliers expect order pull-ins from Apple to gradually turn strong starting from June as the US brand is expected to release its next-generation...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 7 January 2013
Toshiba 20MP BSI CIS
Toshiba has announced that it will launch a new 20-megapixel (MP) CMOS image sensor, the TCM5115CL, as the latest addition to its sensor line-up for digital still cameras. TCM5115CL offers the industry's highest resolution in the 1/2.3 inch optical format, using backside illumination technology (BSI) to improve sensitivity and imaging performance. Sampling of the new sensor will begin at the end of January 2013 and mass production will follow in August 2013. Continued advances in the resolution offered by compact digital cameras -now in the range of 10-16MP - have brought with them the challenge of improving performance and picture quality with smaller pixels. The TCM5115CL does just this by achieving a 15% improvement in full well capacity - the amount of charge an individual pixel can hold before saturating - against Toshiba's previous generation 16MP sensor. TCM5115CL is designed to meet the demands of high quality, fast frame rate image capture and HD video recording supporting smooth, slow motion playback, and delivers 60fps at 1080p and 100fps at 720p.
Nov 22, 17:30
Fashion's shift toward on-demand, real-time production models
Friday 19 November 2021
Digitalizing textile supply chain
Friday 19 November 2021
Textile industry goes digital
Tuesday 16 November 2021
FSP to enter traffic control and energy storage sectors for vision of smart city that never goes offline
8-inch fabs to enjoy robust business growth through 2026, says VIS chair
Taiwan ODMs bracing for looming metaverse boom
Chipmakers ramping up 176-layer 3D NAND output
OLED DDI supply may fall short of demand in 2022
DRAM vendors stay cautious about capacity expansions
Digitimes Research worldwide notebook shipment update – October 2021
V2G tech in EVs provides emergency power supply
Dell becomes the largest notebook brand in October, says Digitimes Research
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