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NEWS TAGGED CMOS IMAGE SENSOR
Friday 28 May 2021
ABF substrate suppliers see clear order visibility through 2023
Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.
Wednesday 28 April 2021
PTI to further expand DRAM backend capacity
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Friday 9 April 2021
Backend houses see order visibility for CIS, sensor chips through 4Q21
Backend houses continue to enjoy strong demand for processing IP camera chips and CMOS image sensor (CIS) chips, with their order visibility clear through the fourth quarter of 2021,...
Wednesday 7 April 2021
Strong sensor demand to buoy suppliers in 2021
Demand for CMOS image sensor (CIS) and other sensors is set to be robust this year, driven by a surge in demand for video conferencing, security surveillance and automotive electronics...
Friday 19 March 2021
Japan, Korea PCB makers shifting production focus to IC substrates
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Thursday 18 March 2021
Taiwan IC packaging-testing firms eyeing automotive CIS
As international design houses of smartphone-use CMOS image sensors (CIS) including Sony, Samsung Electronics, OmniVision and On Semiconductor have shifted 2021 business focus to...
Wednesday 3 February 2021
Backend house Xintec expects strong 1Q21
TSMC-invested backend house Xintec expects to enjoy a particularly strong first-quarter 2021 and stable revenue and profit increases for the entire year, thanks to brisk wafer-level...
Wednesday 27 January 2021
PTI set to boost logic IC backend revenue ratio to 50% in mid-2021
Memory backend specialist Powertech Technology (PTI) is gearing up to expand its business in the logic IC field in 2021 with focus placed on flip-chip packaging and bumping services,...
Monday 25 January 2021
Automotive CIS backend business set to boom throughout 2021
Taiwan's CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries are poised to embrace major growth momentum throughout 2021 as they have landed one-year...
Monday 11 January 2021
IC foundries, designers strengthening tie-up with backend houses
With demand for diverse chips solutions continuing to grow robustly, Taiwan's foundry houses, IC designers and even EMS providers are all strengthening tie-up with backend houses...
Monday 14 December 2020
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Monday 14 December 2020
VIS in talks to acquire 8-inch wafer fab from target seller
Vanguard International Semiconductor (VIS) is again seeking to expand its 8-inch wafer foundry capacity through acquisitions to meet ever-booming demand from vendors of power management...
Friday 11 December 2020
Himax teams up with Edge Impulse for AI chips
Himax Technologies, dedicated to display driver ICs and timing controller (TCON) chips, is set to accelerate the development of AI chips in 2021 through a recent collaboration deal...
Tuesday 1 December 2020
Sony estimates CIS sales for fiscal 2020 to fall 11.8% on weak handset demand
Sony has recently estimated its CMOS image sensor (CIS) sales for fiscal 2020 (April 2020-March 2021) to fall 11.8% on year compared to a 6.5% decline estimated earlier, due mainly...
Monday 16 November 2020
ASE quietly enhancing CIS backend capability
ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...