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NEWS TAGGED DESIGN
Wednesday 6 July 2022
ESMT upbeat about customized SoC memory demand
Demand for customized SoC memory solutions remains relatively brisk compared to conventional memory chips, according to Elite Semiconductor Memory Technology (ESMT). The memory IC...
Tuesday 5 July 2022
IC design houses brace for weak 3Q22
IC design houses are bracing for a particularly weak third-quarter 2022 while also having difficulty negotiating lower foundry quotes, according to industry sources in Taiwan.
Friday 1 July 2022
Xiaomi may renew mobile SoC development via new IC design JV
Chinese handset vendor Xiaomi recently has deepened its in-house chip development by investing in a new semiconductor company, sparking market speculation that Xiaomi may renew development...
Tuesday 28 June 2022
Intento Design secures third round of investment to accelerate commercial deployment
The Paris-based French company, Intento Design, has secured a third round of investment to accelerate its international and commercial deployment on June 22, 2022. Intento Design...
Thursday 23 June 2022
Macroblock cautious about LED driver IC sales prospects for 2H22
LED driver IC design house Macroblock has expressed caution about its sales prospects for the second half of 2022 due to excess inventories for general offerings held by its customers,...
Tuesday 21 June 2022
Taiwan foundries to see fab utilization rates stay above 90% in 2H22
TSMC and other major Taiwan-based foundries have been running their fabs at full capacity utilization, but may see their fab utilization rates drop in the third quarter due to cutbacks...
Tuesday 21 June 2022
IC design houses cut wafer starts at foundries for 3Q22
Many IC design houses, particularly those engaged in the consumer electronics sector, have moved to adjust their wafer starts at foundries amid concerns about a potentially weak third...
Friday 17 June 2022
IC design houses uncertain about demand in 2023
IC design houses are negotiating with upstream foundries about their wafer starts between the end of 2022 and early 2023, but are finding it difficult to plan, according to industry...
Thursday 16 June 2022
PC-related IC suppliers remain positive about commercial notebook demand
Realtek Semiconductor and other Taiwan-based PC-related chip suppliers are pinning their hopes on commercial notebooks despite growing uncertainty in the overall notebook sales this...
Tuesday 14 June 2022
TSMC tightening up payment terms
TSMC is tightening up its payment terms for better cash flow and greater stability, according to industry sources.
Thursday 2 June 2022
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Tuesday 31 May 2022
PWM IC supply for servers remains tight
The supply of server-use power management ICs remains tight, according to industry sources in Taiwan.
Tuesday 31 May 2022
Chipmakers see no cutback in orders for datacenters
TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms' and Google's potential capex cuts,...
Thursday 26 May 2022
IDMs, IC designers gearing up for AIoT market boom
Eyeing promising demand for AIoT device applications, IDMs and IC design houses are entering long-term cooperation to grow related ecosystems highlighting AI-based edge computing...
Friday 20 May 2022
IC design houses bracing for cutback in orders from China handset brands
Taiwan-based IC design houses particularly LCD driver IC firms continue to see their China-based handset clients decelerate their pace of orders, bracing for a potential cutback in...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.