中文網
Taipei
Sun, Sep 19, 2021
09:20
mostly clear
30°C
CONNECT WITH US
NEWS TAGGED DESIGN
Friday 17 September 2021
Flexible AMOLED + On Cell design adopted for iPhone 13 series
Flexible AMOLED + On Cell display design is adopted for 5.4-inch iPhone 13 mini, 6.1-inch iPhone 13, 6.1-inch iPhone 13 Pro and 6.7-inch iPhone 13 Pro Max, according to industry so...
Friday 17 September 2021
MediaTek keen on enriching design talent pool
MediaTek has expanded its recruitment scale in Taiwan, looking to hire an additional over 2,000 design engineers to support its business expansion goals.
Friday 17 September 2021
GaN Systems strikes deal with BMW
GaN Systems has announced the signing of a comprehensive capacity agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Wednesday 15 September 2021
Apple Watch Series 7 features larger displays
Apple has announced Apple Watch Series 7, featuring a re-engineered always-on Retina display with significantly more screen area and thinner borders, making it the largest display...
Monday 13 September 2021
China Big Fund stepping up investment in homegrown memory sector
More China-based memory makers will receive cash injections from the government, as China's National IC Industry Investment Fund (Big Fund) steps up its investment in the country's...
Thursday 9 September 2021
ESMT remains optimistic
Specialty DRAM IC design specialist Elite Semiconductor Memory Technology (ESMT) remains upbeat about its shipment prospects for the rest of this year, thanks to its diversified client...
Thursday 9 September 2021
Taiwan 1st-tier IC design houses poised to raise prices in 1Q22
With delivery lead times at TSMC extended to 4-5 months, Taiwan's first-tier IC design houses have notified customers about further price hikes for their chip solutions starting the...
Thursday 9 September 2021
Arm, Taiwan's ITRI join force to help IC design startups grow
Arm is partnering with Taiwan's Industrial Technology Research Institute (ITRI) to develop an ecosystem platform available for international IC design startups looking to invest in...
Monday 6 September 2021
Highlights of the day: IC design houses brace for weaker profits
IC design houses are caught between rising foundry costs and weakening end-market demand. The IC designers' sales and...
Monday 6 September 2021
IC design houses set to slow down shipments in 4Q21
Taiwan IC design houses are expected to slow down their shipments in the fourth quarter of the year, as downstream clients have recently started to soften their shipment pull-in momentum,...
Monday 6 September 2021
IC design houses to see sales and profits eroded by rising foundry costs
IC design houses will likely see their sales and profits eroded by rising foundry costs later this year, as their downstream customers are increasingly reluctant to accept higher...
Monday 6 September 2021
SK Hynix foundry biz posts profit surge in 1H21
Specializing in 8-inch wafer foundry fabrication services for analog and mixed-signal ICs, SK Hynix System IC has disclosed net profits climbed 42.7% on year to KRW76.1 billion (US$65.8...
Friday 3 September 2021
Rising quotes proposed by Taiwan foundries unlikely to affect foreign chip clients pricing strategy
China- and Taiwan-based fabless chipmakers have been raising their chip prices to reflect rising foundry costs since 2021, and are mulling another price hikes later this year and...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.