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Thursday 13 January 2022
ESMT sees bullish NOR flash prices
NOR flash contract prices are poised to stay flat sequentially in the first quarter of 2022 and will rise through the third quarter, according to MC Chang, president for memory IC...
Thursday 13 January 2022
Micron enters volume shipments of 176-layer QLC NAND SSDs
Micron Technology has begun volume shipments of 176-layer QLC NAND SSDs, according to the company.
Tuesday 11 January 2022
Industry watch: The benchmarks and opportunities of the IC design industry
Founded in 1997, MediaTek originated from the UMC Group which was founded in the 1980s. The management team has witnessed the wonderful era "from micrometer to sub-microns" in Taiwan...
Friday 7 January 2022
Notebook peripheral IC specialists report strong sales for 2021
Notebook IC design specialists particularly those engaged in peripheral chips including touchscreen controllers and high-speed interface chips have reported impressive sales results...
Thursday 6 January 2022
Specialty DRAM prices soon to stop falling
DDR3 and other specialty DRAM prices are expected to stop falling and begin to rise as early as between the end of the first quarter and the second quarter, according to industry...
Tuesday 4 January 2022
Nissan tweaks car design to tackle chip shortage
While the auto chip shortage is easing, some electronic components suppliers continue delaying delivery. The situation prompted carmakers like Nissan to adjust the design to use different...
Thursday 23 December 2021
Taiwan OSATs upbeat about orders for automotive, commercial chips
Taiwan-based IC backend houses have seen their international customers scale up orders for processing midrange and high-end chips for automotive and commercial device applications,...
Thursday 23 December 2021
Taiwan IC design houses to accept foundry price hikes
Taiwan-based IC design houses including first-tier players are aware they will have to accept price increases proposed by pure-play foundries in order to obtain more available fab...
Thursday 23 December 2021
Automotive UI/UX design receives industry attention
In-vehicle user interface (UI) and user experience (UX) design has attracted more attention from automakers recently as they try to unlock the full potential of software-defined vehicles...
Wednesday 22 December 2021
High-end IC testing demand to stay robust in 2022
Testing demand for HPC chips, mobile application processors, wireless connectivity chips, and other high-end logic chips will stay strong in 2022, according to sources at Taiwan-based...
Wednesday 22 December 2021
Unisoc adopts Imagination AI in 5G chips
Unisoc has used Imagination Technologies' Series3NX neural network accelerator (NNA) IP in its new smartphone 5G platforms - Tanggula T770 and T760 system-on-chips (SoC), according...
Monday 20 December 2021
Xiaomi sets up CNY1.5 billion subsidiary for ICs
Xiaomi has quietly set up a new company with a registered capital of CNY1.5 billion (US$235.3 million) through subsidiary X-Ring Limited, according to industry sources in China.
Thursday 16 December 2021
TSMC intros N4X process
TSMC has introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products.
Thursday 16 December 2021
Taiwan chipmakers gearing up for WBG semiconductors
Taiwan-based chipmakers, led by foundry TSMC and silicon wafer supplier GlobalWafers, are gearing up to tap into the market for gallium nitride (GaN), silicon carbide (SiC) and other...
Wednesday 15 December 2021
Etron with in-house developed KOOLDRAM enters car industry supply chain
Etron Technology's in-house developed KOOLDRAM products are being adopted by car vendors, a milestone for its entry into the automotive sector, according to the Taiwan-based niche-market...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.