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NEWS TAGGED DISPLAY
Friday 24 September 2021
DDI backend firms to enhance advanced testing capacity
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are looking to enhance their high-end testing capability, eyeing promising growth in demand for...
Friday 17 September 2021
Mirle Automation sees order backlog swell
Mirle Automation, dedicated to supplying automated logistics systems and flat panel display (FPD) transporting equipment, has seen its backlog of orders exceed NT$10 billion (US$360.6...
Thursday 16 September 2021
Corning names new president for CDTT
Corning has appointed Andrew Ho as president of Corning Display Technologies Taiwan (CDTT), replacing Daniel Tseng, who has been named president and general manager of Corning Display...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Thursday 16 September 2021
MSI adopts AUO miniLED display technology in creator notebook
AU Optronic's (AUO) AmLED (adaptive miniLED) display technology is featured in MSI's new creator notebook series.
Wednesday 15 September 2021
91.4 million automotive display panels shipped globally in 1H21
Global automotive display panel shipments reached 91.4 million units in first-half 2021, increasing 39.1% on year, according to Omdia.
Wednesday 15 September 2021
Apple to place orders for around 90 million units of iPhone 13 series for 2021
Apple will place orders for around 90 million units of the freshly launched iPhone 13 series with its upstream assemblers for 2021, Digitimes Research estimates.
Wednesday 15 September 2021
Apple Watch Series 7 features larger displays
Apple has announced Apple Watch Series 7, featuring a re-engineered always-on Retina display with significantly more screen area and thinner borders, making it the largest display...
Tuesday 14 September 2021
Industrial memory demand slowing down
Industrial memory demand picked up in the second quarter, but has started slowing down during the latter half of the third quarter due to seasonal factors, according to industry so...
Tuesday 14 September 2021
DDI backend houses to strengthen high-end testing capacity expansions in 2022
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Friday 10 September 2021
China silicon wafer maker secures CNY3.3 billion in Series B
Hangzhou Semiconductor Wafer, a silicon wafer subsidiary owned previously by Japan's Ferrotec, has closed CNY3.3 billion (US$510 million) in its Series B funding round and will be...
Tuesday 7 September 2021
Foundries step up capacity expansions
Pure-play foundries have accelerated their capacity expansions as they have seen promising demand for cloud computing, AI, EV, 5G and IoT related applications, with order visibility...
Monday 6 September 2021
PSMC to raise foundry quotes by about 10% in 4Q21
Pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) plans to initiate a further price hike of about 10% mainly for its logic IC process manufacturing, with the new pricing...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.