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NEWS TAGGED EUV
Monday 4 July 2022
ASML, TSMC shed lights on advanced solutions at CSTIC 2022
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
Friday 17 June 2022
TSMC debuts N2 process utilizing nanosheet transistors
TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...
Monday 13 June 2022
Micron to commercialize 1-gamma EUV process in Taiwan in 2024
US memory vendor Micron Technology is set to move its 1-gamma EUV process technology to volume production at its new fab, A3, in central Taiwan in 2024, and will install the first...
Tuesday 7 June 2022
Samsung falters in semiconductor progress despite earlier switch to EUV tech
Samsung Electronics' three semiconductor business divisions - memory, system LSI, and foundry - seem to have encountered development bottlenecks, which might be a result of ill-advised...
Thursday 26 May 2022
Micron to start installing EUV fab tools at Taiwan plant at end of 2022
Micron Technology has disclosed plans to start installing EUV fab tools at its DRAM plant in Taichung, central Taiwan later this year.
Wednesday 25 May 2022
Global top-3 DRAM makers hold 94% of 2021 market
Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...
Wednesday 27 April 2022
ASML capacity ramp to buoy its Taiwan-based partners
ASML has disclosed plans to expand production capacity for both its EUV and deep-UV systems by 2025, and the lithography tool vendor is on track to ship 55 sets of EUV systems in...
Wednesday 13 April 2022
Edwards working with chipmakers to cut carbon emissions
Edwards, which makes vacuum pumps and advanced exhaust systems used in semiconductor manufacturing, is working closely with the world's major foundries to reduce carbon emissions...
Thursday 24 March 2022
Samsung, Intel keen to take slices of foundry market from TSMC
Samsung Electronics and Intel have both stepped up efforts to expand their respective foundry businesses, eyeing bigger slices of the global foundry market particularly in the advanced...
Monday 7 March 2022
Taiwan foundries may be haunted by power shortage
A recent unexpected large-scale power outage in Taiwan has rekindled worries among foundries that they could suffer not only insufficient power supply during the peak power-consumption...
Friday 4 March 2022
Marketech, Gudeng, and GPI see strong demand from TSMC
Fab toolmakers Marketech International, Gudeng Precision Industrial, and Gongin Precision Industrial (GPI) have enjoyed strong demand from TSMC, which is gearing up for volume production...
Friday 18 February 2022
Fab toolmakers on track to gain big from bold TSMC capex plans
Fab toolmakers worldwide are all poised to score significant revenue gains in 2022 and beyond from fulfilling robust orders from TSMC, which is set to invest over US$100 billion during...
Friday 11 February 2022
Foundry capacity expansion projects may face delays
The ongoing COVID-19 pandemic has caused bottlenecks in labor relations, transport, and logistics operations worldwide, which may lead to delays in foundries' installation of new...
Friday 28 January 2022
Samsung foundry revenue sets record high in 4Q21
Samsung Electronics has reported consolidated revenue climbed to a record high of KRW76.57 trillion (US$63.65 billion) in the fourth quarter of 2021, when its foundry business posted...
Monday 24 January 2022
Shanghai incentivizes development of IC equipment, EDA tools
The Shanghai municipal government has newly released a package of generous incentives to encourage investments in the development and production of semiconductor materials and equipment,...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.