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Wednesday 22 September 2021
MediaTek releases Kompanio 900T AP for tablets
MediaTek has recently launched the Kompanio 900T AP for Android-based tablets and expects the chip to help it maintain the leadership in the Android tablet AP market.
Thursday 9 September 2021
Arm, Taiwan's ITRI join force to help IC design startups grow
Arm is partnering with Taiwan's Industrial Technology Research Institute (ITRI) to develop an ecosystem platform available for international IC design startups looking to invest in...
Thursday 2 September 2021
Suppliers eyeing demand boom for high-speed transmission chip solutions
Taiwan's vendors of transmission interface chip solutions are stepping up the development and production of high-speed solutions such as Wi-Fi 6E, PCIe4.0/5.0 controller chips and...
Thursday 2 September 2021
IC testing interface vendors to enjoy strong demand for new-gen processors
As AMD and Nvidia are warming up for rolling out new-generation CPU and GPU processors in first-half 2022, Taiwan-based IC test solutions providers including Chunghwa Precision Test...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Friday 27 August 2021
ABF substrate suppliers see more customers seek long-term deals
ABF substrate makers have seen more of their customers eager to strike long-term agreements to ensure sufficient supplies through 2025 and even beyond, as tight supply is expected...
Tuesday 17 August 2021
Arm-based notebook processor shipments post 5-fold jump in 2020
Arm-based notebook computing chips jumped nine-fold in revenue terms and five-fold in unit terms in 2020, according to Strategy Analytics.
Wednesday 11 August 2021
Samsung intros 5nm processor for wearables
Samsung Electronics has announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem, and is built with an advanced 5nm extreme ultra-violet (EUV)...
Tuesday 3 August 2021
OSATs in talks with substrate suppliers about 2023 orders
Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...
Friday 23 July 2021
ABF substrate supply may stay short of demand through 2023
ABF substrate supply is likely to remain short of demand through 2023 although makers in Taiwan, Japan and South Korea have all geared up capacity expansions at the request of chipmaking...
Wednesday 30 June 2021
Fierce competition among HPC chip suppliers to benefit TSMC
Foundry market leader TSMC has been pinpointed as a major beneficiary of the increasingly fierce competition among HPC chip providers, according to market sources.
Friday 25 June 2021
Lead times for aluminum capacitors prolonged to over 20 weeks
Delivery lead times for aluminum electrolytic capacitors have been prolonged to over 20 weeks, as demand continues to strengthen for applications ranging from power supply units,...
Wednesday 16 June 2021
Hermes Testing poised to tap cantilever probe card market
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...
Thursday 3 June 2021
AT&S to set up ABF substrate production base in Southeast Asia
AT&S has disclosed plans to invest EUR1.7 billion (US$2.07 billion) to set up a new production base for ABF substrates in Southeast Asia to satisfy the needs of its major HPC...
Wednesday 2 June 2021
Nvidia intros flagship GPUs
Nvidia has announced the GeForce RTX 3080 Ti and 3070 Ti GPUs for content creators specializing in video editing, 3D animation or architectural visualization at Computex 2021.