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NEWS TAGGED HETEROGENEOUS INTEGRATION
Wednesday 10 August 2022
Heterogeneous integration to boost EV-use SiC, GaN performance
Third-generation compound semiconductors such as SiC and GaN are very crucial to the future development of electrical vehicles (EV) and green power industries, and heterogeneous integration...
Wednesday 3 August 2022
AP Memory expects gross margin to pick up in 2H22
Taiwan-based AP Memory Technology, a Powerchip Technology subsidiary specializing in customized DRAM memory designs and IPs, expects its gross margin to pick up in the third and fourth...
Monday 4 July 2022
ASML, TSMC shed lights on advanced solutions at CSTIC 2022
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Thursday 2 June 2022
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Monday 14 March 2022
SAIC aggressively aiming to operate as RF IDM
China-based Sanan Integrated Circuit (SAIC), a compound semiconductor specialist under Sanan Optoelectronics Group, is actively developing itself into an RF IDM to support the country's...
Thursday 3 March 2022
AP Memory eyes AI, IoT applications as growth drivers in 2022
Taiwan-based AP Memory Technology, specializing in customized memory chip designs and IPs, expects its 2022 revenues to grow further on strong shipments of its AI memory solutions...
Wednesday 23 February 2022
ASE eyeing backend orders for Apple-designed 5G modem chips
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
Wednesday 29 December 2021
Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
Tuesday 28 December 2021
Heterogeneous integration, compound semi in spotlight at SEMICON Taiwan 2021
SEMICON Taiwan 2021 has kicked off in Taipei running from December 28-30, with this year's theme focusing on heterogeneous integration, compound semiconductors and other chipmaking...
Monday 20 December 2021
Apple reportedly moves to develop own RF chips
Apple is reportedly hiring talent to develop RF solutions, modem chips and other wireless semiconductors in house, sparking market concerns about possible impacts on its suppliers...