Despite global automotive semiconductor market being dominated by IDMs in Europe, the US and Japan, Taiwan's backend service leader ASE Technology Holding has been strengthening its...

Nepcon Japan 2020 running January 15-17 in Tokyo saw its first-day semiconductor forum steal the show with heavyweight firms TSMC and Micron shedding light on latest packaging technologies...

Ansys has increased its R&D workforce in Taiwan by 50% to support its local chipmaking partners, according to Roger Lee, company country manager for Taiwan.

Taiwan IC substrate makers will have no time to lose in expanding their ABF substrate capacities as demand for such substrates will grow substantially in 2020 and beyond along with...

Chunghwa Precision Test Tech (CHPT) saw sales generated from its new VPC (vertical probe card) product line grow to account for a double-digit percentage of the company's total revenues...

Foxconn Electronics has offered a high-performance computing (HPC) facility for use by National Taiwan University (NTU) Cancer Center, according to Yong Lin Health Care Foundation...

Chinese chipmakers are revving up development of HPC (high performance computing) chips for AI and deep learning applications, which are expected to become available for volume production...

Baidu and Samsung Electronics have announced jointly that Baidu's first cloud-to-edge AI accelerator, Baidu Kunlun, has completed its development and will be mass-produced early next...

Robust orders for advanced fabrication and packaging services at TSMC have prompted the foundry to team up with Materials Analysis Technology (MA-tek) and Integrated Service Technology...

TSMC has placed orders for several hundred sets of test equipment with Teradyne, and will install the tools at the foundry's new advanced backend plant in northern Taiwan, according...

Cadence Design Systems has announced that Global Unichip Corporation (GUC) successfully deployed its digital implementation and signoff flow and delivered advanced-node (N16, N12...

Taiwan-based clean room engineering specialist Acter is expected to see its revenues pick up steadily in 2020 as major clients in Taiwan and China will boost capex to step up major...

FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that...

High-end FPGA chips demand is mounting significantly for datacenter, 5G and AIoT applications, providing growth momentum for related wafer foundry, analysis and test players as well...

Intel, addressing the increasing use of heterogeneous architectures in high-performance computing, has announced a new category of discrete general-purpose GPUs optimized for AI and...

Taiwan-based PCB makers are planning to maintain normal production during the Lunar New Year holidays in late January thanks to clear visibility of orders from Apple and Chinese handset...

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction of new fab facilities, installation...

Taiwan-based IC testing interface supplier WinWay Technology has entered the supply chains of major chipmakers in the US and China with high-end customized IC sockets and will venture...

Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...

TSMC is set to enjoy another year of record-high sales in 2019, but net profits are unlikely to break the record high set last year due mainly to disappointing results during the...

TSMC expects to enjoy another quarter of record high revenues, while adding an additional US$4 billion in its full-year capital budget. The pure-play foundry has forecast revenues...

Taiwan-based Unimicron and Na Ya PCB have both seen revenues for the third quarter of 2019 reach high levels thanks to robust shipments of ABF substrates, and the growth momentum...

The global IC foundry industry output value will grow by a CAGR of 5.3% to reach US$75.42 billion in 2024, the final year of a five-year forecast period, driven by chip demand for...

According to Digitimes Research's observation, the server market is experiencing sluggish growth in 2019 with customer inventory level running high. However, as inventory depletion...

Arm and TSMC have announced jointly an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC's chip-on-wafer-on-substrate (CoWoS) advanced...