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NEWS TAGGED HUAWEI
Friday 17 September 2021
China stepping up deployments in homegrown car-use SiC modules
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
Wednesday 1 September 2021
Downward pressure on pricing drives momentum in wearables, says IDC
Global wearables shipments grew 32.3% on year as volumes reached 114.2 million during the second quarter of 2021, according to IDC.
Tuesday 31 August 2021
Honor becomes 3rd-largest handset brand in China
Honor sold four million handsets in China in July, becoming China's third-largest handset brand, according to CINNO Research.
Friday 20 August 2021
Global tablet market – 2Q 2021
Global tablet shipments reached 34.69 million units in the second quarter of 2021, down 3.5% sequentially and 12.5% on year.
Thursday 19 August 2021
Taiwan large-size LCD panels – 2Q 2021
Taiwan's large-size LCD panel shipments reached 71.93 million units in the second quarter of 2021, down 0.4% sequentially, but up 11.7% on year.
Wednesday 18 August 2021
China smartphone AP shipments – 2Q 2021
Second-quarter 2021 smartphone application processor (AP) shipments to China-based vendors amounted to 218 million units, up 3% quarter-over-quarter.
Tuesday 17 August 2021
China smartphone market and industry – 2Q 2021
Second-quarter 2021 smartphone shipments to the China market came to 72.2 million units, plunging 23.7% quarter-over-quarter.
Monday 16 August 2021
Apple orders account for over 20% of TSMC total wafer revenue
Apple has been TSMC's largest client, with its chip orders for the iPhone, iPad and Apple Watch continuing to account for more than 20% of the foundry's total wafer revenue, according...
Thursday 12 August 2021
Taiwan small- to mid-size LCD panels – 2Q 2021
Taiwan's small- to medium-size panel shipments increased 11.7% sequentially, but went down 9% on year to arrive at 209.76 million units in the second quarter of 2021.
Monday 9 August 2021
PA shipments to China for 5G base stations remain weak in 2H21
RF amplifier (PA) demand from 5G base stations in China remains weak although China telecom operators have resumed construction of 5G networks, mainly because the majority of related...
Thursday 5 August 2021
China smartphone vendors see combined shipments fall in 2Q21
China-based vendors shipped a total of 160 million smartphones worldwide in the second quarter of 2021, down 16.4% sequentially and 3.2% on year. But shipments will rebound to a 14%...
Wednesday 4 August 2021
Unisoc raises smartphone chip prices
China's Unisoc has raised its smartphone chip prices by about 25% with the new pricing becoming effective starting August, according to industry sources.
Tuesday 3 August 2021
Apple to sharply up components pull-ins for new iPhones in 2H21
Apple is expected to significantly increase its pull-ins of components shipments for new iPhones in the second half of the year, driven by its impressive growth in market share in...
Monday 26 July 2021
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Monday 4 September 2017
IFA 2017: Huawei Kirin 970
Huawei has launched the Kirin 970 at IFA 2017 in Berlin, a chip that combines the power of the cloud with the speed and responsiveness of native AI processing, according to the company. Cloud AI has seen broad application, but user experience still has room for improvement, including latency, stability, and privacy, according to the vendor. Cloud AI and on-device AI can complement each other. On-device AI offers strong sensing capabilities, which are the foundation of understanding and assisting people. Sensors produce a large amount of real-time, scenario-specific, and personalized data. Supported by strong chip processing capabilities, devices will become more cognitive of user needs, providing personalized and readily accessible services. Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU. Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one square centimeter. Huawei's new flagship Kirin 970 is its first mobile AI computing platform featuring a dedicated neural processing unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970's new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. The Kirin 970 can perform the same AI computing tasks faster and with far less power, Huawei claims. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, which was faster than other chips on the market. Huawei is positioning the Kirin 970 as an open platform for mobile AI, opening up the chipset to developers and partners.