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NEWS TAGGED IC
Friday 15 October 2021
Highlights of the day: Automotive IC shortages to remain
The car industry has been plagued by component shortages, and automotive IC shortages are likely to last till at least...
Friday 15 October 2021
Chipmakers gearing up for Wi-Fi 6/6E chip boom
Chipmakers including MediaTek, Qualcomm, and Broadcom are set to ramp up their output for Wi-Fi 6/6E chip solutions looking to embrace booming demand for such chips and increase their...
Friday 15 October 2021
Automotive IC shortage to persist for next 2-3 years
The global shortage of automotive ICs is likely to last beyond next year until 2023 or even 2024, and automakers worldwide are trying all possible means to counter, according to industry...
Friday 15 October 2021
Will foundry expansions lead to capacity glut?
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
Thursday 14 October 2021
Uneven inventories across chipmakers still persist, say IC distributors
Uneven inventories across chipmakers will continue to challenge device vendors and OEMs in the fourth quarter of 2021, despite uncertainty emerging in demand visibility, according...
Thursday 14 October 2021
Chip delivery times reportedly reach nearly 22 weeks
The impact of government-led power restrictions on China's local industry supply chains is threatening to prolong delivery lead times for ICs, according to industry sources in Chin...
Wednesday 13 October 2021
DDI backend firms expect flat growth in 4Q21
Taiwan-based display driver IC (DDI) backend specialists expect to post flat sequential revenue growth in the fourth quarter of 2021, as tight foundry capacity constrains their fabless...
Wednesday 13 October 2021
Taiwan DDI suppliers poised to generate significant revenue increases in 2021
Despite uncertainty emerging over the demand outlook for the fourth quarter, Taiwan-based display driver IC (DDI) specialists are all poised to generate signifiant revenue increases...
Wednesday 13 October 2021
Taiwan IC design houses combat rising wafer foundry costs
TSMC's plans to raise its foundry service quotes have caused a stir among its customers. Wafer foundry and packing/testing production capacity prices have been going up. The price...
Tuesday 12 October 2021
Nan Ya PCB posts record 3Q21 revenue
PCB and IC substrate supplier Nan Ya PCB saw its September revenue drop 4.6% sequentially due to the impact of power restrictions imposed by the local government on its plant in Kunshan,...
Tuesday 12 October 2021
Taiwan-based power management IC makers have strong 3Q21
The power management integrated circuits (PMIC) market continued to thrive in third-quarter 2021.
Friday 8 October 2021
Egis board approves investments in three companies
The board of directors of Egis Technology, a Taiwan-based IC design house specializing in fingerprint sensors, has approved plans to make investments in three firms - PC peripheral...
Friday 8 October 2021
Samsung reportedly to build additional ABF substrate capacity
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Friday 8 October 2021
PCB maker Zhen Ding Technology to produce BT, ABF substrates
PCB maker Zhen Ding Technology Holding will begin production of BT and ABF substrates at its factories in China in 2022, according to industry sources.
Thursday 7 October 2021
Global server shipment forecast, 2022 and beyond
Large datacenter demand will remain the main growth driver for server shipments 2021 through 2026. On top of that, 5G white-box telecom datacenter demand will also spur some growth...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.