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NEWS TAGGED IC
Tuesday 17 May 2022
DDI prices under strengthening downward pressure
LCD display driver IC (DDI) prices, particularly those for handsets, are poised to fall further in the second quarter of 2022, and even handset-use OLED DDI prices are likely to fall...
Tuesday 17 May 2022
Brand notebook vendors cut orders for 2022
Brand notebook vendors have cut back orders with suppliers in 2022, particularly orders for Chromebooks, and have also revised downward annual shipment targets, according to sources...
Tuesday 17 May 2022
PWM IC suppliers continue to see supply constrained
Power management IC suppliers, including those engaged mainly in the consumer electronics field, continue to see their supply remain constrained, according to industry sources.
Monday 16 May 2022
The memory industry (6): When line between memory and logic IC becomes blurred
In 1984, Intel decided to exit the DRAM business, which marked the start of technology diversion between memories and logic IC. In hindsight, Intel's decision made sense. Memories...
Friday 13 May 2022
Himax expects revenue drop in 2Q22
Display driver IC (DDI) specialist Himax Technologies expects to post a 16-20% sequential decline in second-quarter revenue, with gross margin ranging from 43% to 45%.
Friday 13 May 2022
PWM IC firm uPI posts profit surge in 1Q22
Taiwan-based uPI Semiconductor, an Asustek Computer affiliate specializing in power management ICs, saw its net profits surge 135% on year to NT$401 million (US$13.4 million) in the...
Thursday 12 May 2022
Acter posts record IC fab engineering projects in Taiwan, China
Taiwan's clean room engineering specialist Acter Group has seen a record high number of ongoing contract construction engineering projects, as semiconductor fabs in Taiwan and China...
Thursday 12 May 2022
Analog IC firm GMT cautious about 2Q22
Global Mixed-mode Technology (GMT), a fabless supplier of analog and power management ICs, has expressed caution about its operations in the second quarter of 2022 citing growing...
Thursday 12 May 2022
IC design houses under pressure to drop prices
IC design houses, particularly those specializing in chips for handsets and other mass-market device applications, are under pressure to lower their prices amid sluggish end-market...
Thursday 12 May 2022
PWM IC firms expect more available 8-inch fab capacities in 2023
With their bigger peers transitioning to 12-inch wafer manufacturing, Taiwan-based power management IC (PWM IC) suppliers expect more 8-inch fab capacities to be available to satisfy...
Wednesday 11 May 2022
IC designers uncertain about inventory management strategies
Taiwan-based IC design firms are uncertain whether they should build up or lower their inventories, as challenges caused by inflation, the Russia-Ukraine war, the COVID-induced lockdowns...
Wednesday 11 May 2022
IC equipment maker Trusval stays positive about sales prospects
Taiwan-based semiconductor equipment maker Trusval Technology remains optimistic about its business prospects for the second quarter, as its chipmaking customers are still stepping...
Wednesday 11 May 2022
Taiwan III-V IC makers deliver samples for Wi-Fi 7 RF FEM
Taiwan-based gallium arsenide (GaAs) foundries and epi-wafer suppliers have started delivering epi-wafer samples, which are used in power amplifiers (PA) for Wi-Fi 7 radio-frequency...
Wednesday 11 May 2022
Industrial IC prices rise on tight supply
Industrial-control IC prices have risen amid tight supply, according to sources at IC distributors.
Wednesday 11 May 2022
MediaTek posts revenue decline in April
Lockdown restrictions in major Chinese cities have made an adverse impact on end-market demand and also supply chains involving mobile SoC specialist MediaTek, which saw its April...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.