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NEWS TAGGED IC
Thursday 5 August 2021
Growth expected for nearly all IC products in 2021
IC Insights has released its ranking of revenue growth rates for the 33 IC product categories in 2021, and forecast for 2021. Among the 33 IC product categories, 32 will exprerience...
Wednesday 4 August 2021
Testing houses to see strong 1Q22
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
Wednesday 4 August 2021
Taiwan backend houses bracing for robust China mature-node chips demand
Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...
Wednesday 4 August 2021
Foundry quotes for mature processes to rise through 1Q22
Taiwan-based 8- and 12-inch foundries are all poised to raise their quotes for mature process technologies at a quarterly pace of at least 5-10% through the first quarter of 2022,...
Tuesday 3 August 2021
COF substrate, probe card demand stays robust for processing DDI chips
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Tuesday 3 August 2021
China PCB maker DSBJ to step into IC substrate market
China's PCB maker Dongshan Precision Manufacturing (DSBJ) has disclosed plans to invest CNY1.5 billion (US$232.1 million) in establishing a new wholly-owned subsidiary that will be...
Tuesday 3 August 2021
Taiwan networking IC suppliers gain shifted orders
IC design houses, such as MediaTek and Realtek Semiconductor, have landed a ramp-up in orders from Taiwan-based networking device makers, which are encountering longer delivery lead...
Tuesday 3 August 2021
Standard IC supply to stay tight in short term
The supply of standard ICs including LCD driver ICs, MOSFET chips, 4- and 8-bit MCUs, and specialty DRAM chips will remain tight in the short term, as foundries give their supply...
Monday 2 August 2021
Taiwan DDI chip suppliers poised to enjoy strong 3Q21
Taiwan-based display driver IC (DDI) suppliers including Fitipower Integrated Technology, FocalTech Systems, Himax Technologies, Novatek Microelectronics, Raydium Semiconductor and...
Monday 2 August 2021
DDI backend quotes trending upward
Display driver IC (DDI) backend quotes will be rising again in the third quarter of 2021 to reflect supply-side constraints, according to industry sources.
Friday 30 July 2021
Primax expects acoustic components sales to drive 3Q21 growth
Primax Electronics has expressed optimism about its operations in the third quarter of 2021, citing robust growth of its acoustic components sales.
Friday 30 July 2021
IC unit shipments to surge 21% in 2021
IC unit shipments are forecast to surge 21% in 2021, following an 8% increase in 2020 and a 6% drop in 2019, according to IC Insights.
Friday 30 July 2021
IC backend sector to see new supply-demand balance in 2023, says ASE Technology
ASE Technology expects the IC backend sector not to reach a new balance between supply and demand until 2023 at the earliest, and it has landed some long-term orders set for fulfillment...
Thursday 29 July 2021
MediaTek terminates deal to acquire assets related to PWM IC from Intel
MediaTek has announced that on behalf of subsidiary Richtek Technology, its agreement with Intel to acquire assets related to the power management solutions product line sold under...
Thursday 29 July 2021
CHPT expects revenue increases through 4Q21
Taiwan-based IC test solutions provider Chunghwa Precision Test Tech (CHPT) expects to post sequential revenue increases through the fourth quarter of 2021, buoyed by growing demand...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.