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NEWS TAGGED JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY
Monday 26 July 2021
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
Thursday 8 July 2021
China OSATs step up deployments in advanced packaging field
China-based OSATs including Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics have stepped up their deployments in the advanced packaging...
Thursday 2 July 2020
China top-3 OSAT firms to see combined revenues rise 8% in 2020, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics - are expected to see their combined revenues increase...
Monday 6 April 2020
China revving up IC backend equipment development
China is expanding its semiconductor equipment self-sufficiency, with homegrown makers stepping up development of wet process and high-end back-end packaging equipment to serve domestic...
Thursday 26 December 2019
Chinese backend firm JCET enters supply chain of Samsung, LG
China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
Thursday 24 October 2019
China IC backend firms poised for strong 2020
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
Monday 21 October 2019
Kingsemi debuts on China STAR market
Semiconductor equipment supplier Kingsemi started trading its shares on the science and technology innovation board (STAR) of China's Shanghai Stock Exchange (SSE) October 21.
Thursday 5 September 2019
Major China OSAT firms post losses for 1H19
Major China-based outsourced semiconductor assembly and test (OSAT) providers Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have both reported...
Wednesday 31 July 2019
JCET kicks off 12-inch wafer bumping production in S Korea
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
Friday 22 March 2019
Spirox, ShibaSoku team up
Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with Japan's ShibaSoku under which Spirox will sell ShibaSoku's semiconductor test...
Thursday 27 December 2018
China OSAT firms foraying into higher-end packaging fields
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
Friday 2 November 2018
China not necessarily top job destination for Taiwan IC packaging talent
China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
Friday 22 June 2018
Taiwan OSAT firms suffer unclear order visibility for 3Q18
After experiencing lackluster revenue and profit performances in the first half of 2018, Taiwan OSAT (outsourced semiconductor assembly and test) players still see unclear visibility...
Friday 1 June 2018
China IC backend output value to exceed US$30 billion in 2018, says Digitimes Research
The output value of China's IC packaging and testing industry will exceed US$30 billion for the first time in 2018, according to Digitimes Research.
Thursday 8 February 2018
China IC backend houses vying for orders for mining ASICs
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...