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NEWS TAGGED KINSUS
Thursday 23 September 2021
ABF substrate supply to remain constrained in 2022
Due to spec upgrades of new processors and growing difficulty in producing high-end ABF substrates with satisfactory yield rates, the world's actual ABF substrate supply growth could...
Friday 17 September 2021
AiP substrate shipments for new iPhones set to rise
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
Wednesday 8 September 2021
Kinsus to enjoy sales growth through 4Q21
IC substrate maker Kinsus Interconnect Technology is expected to post sequential revenue increases through the fourth quarter of 2021, buoyed by strong ABF and BT based substrate...
Friday 27 August 2021
ABF substrate suppliers see more customers seek long-term deals
ABF substrate makers have seen more of their customers eager to strike long-term agreements to ensure sufficient supplies through 2025 and even beyond, as tight supply is expected...
Tuesday 10 August 2021
Taiwan IC substrate makers to enjoy strong 2H21
Unimicron Technology, Kinsus Interconnect Technology and Nan Ya PCB are all poised to generate substantial revenue increases in the second half of 2021, as strong order momentum for...
Tuesday 3 August 2021
OSATs in talks with substrate suppliers about 2023 orders
Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...
Thursday 29 July 2021
Taiwan supply chain gearing up shipments for new iPhones
TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including...
Wednesday 28 July 2021
IC substrate maker Kinsus posts 2-fold profit jump in 2Q21
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Monday 19 July 2021
ABF substrate prices poised to rise further in 2H21
ABF substrate prices are likely to rise quarter by quarter in the second half of the year, as demand for such substrates continues to outgrow new capacity supply, according to industry...
Thursday 8 July 2021
Arrival of new capacity drives Nan Ya, Kinsus revenue growth
Nan Ya PCB and Kinsus Interconnect Technology both saw their June revenue climb over 30% from a year earlier, driven mainly by the arrival of new production capacity, according to...
Wednesday 30 June 2021
Apple reportedly enlists five suppliers of AiP substrates for new mmWave iPhnones
Apple reportedly has enlisted AT&S as a new supplier of BT-based AiP (antenna in package) substrates for new 5G mmWave iPhones to be released later in the year, expanding to five...
Monday 28 June 2021
Intel, AMD, Nvidia in keen competition for ABF substrate capacity
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Thursday 24 June 2021
BT substrate suppliers kicking off shipments for new Apple devices
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
Tuesday 8 June 2021
Strong IC substrate shipments continue to buoy Nan Ya, Kinsus
Nan Ya PCB and Kinsus Interconnect Technology continued to see their May sales driven by robust shipments of IC substrates, and are both poised to enjoy a strong 2021, according to...
Tuesday 1 June 2021
Fuyang on track to transform into ABF substrate specialist
Fuyang Technology will be transforming into a manufacturer of ABF substrates after losing flexible PCB orders from Apple in 2020, with its business restructuring led by Kinsus Interconnect...
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Vedanta looking for chip customers in advance
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
IC design houses bracing for cutback in orders from China handset brands
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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