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NEWS TAGGED KINSUS
Tuesday 25 February 2020
Taiwan small- to mid-size LCD panels – 4Q 2019
The fourth quarter of 2019 was a traditional slow season for the small- to medium-size panel industry, but Taiwan's shipments still grew 16.6% sequentially in the quarter thanks to...
Friday 21 February 2020
USI may enter backend supply chain of AirPods Pro series
Taiwan-based Universal Scientific Industrial (USI), a unit of ASE Technology, is likely to obtain system-in-package (SiP) orders for AirPods Pro Lite, which may also benefit Taiwanese...
Thursday 13 February 2020
Apple reportedly in high demand for 5nm A14 to support 5G devices
Apple's demand for 5nm A14 mobile application processors (AP) to support its 5G devices is likely to be 50-60% higher than that for its 7nm A13, highlighting the vendor's determination...
Wednesday 22 January 2020
PCB makers revving up capacity expansion for ABF substrates
Taiwan-based IC substrate makers Unimcron, Na Ya PCB and Kinsus Interconnect Technology are actively proceeding with capacity expansions for ABF substrates in 2020 to meet robust...
Thursday 16 January 2020
IC substrate makers to gain from AiP modules for Apple 5G devices
Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...
Wednesday 8 January 2020
Nan Ya, Kinsus see bright prospect for diverse IC substrates in 2020
IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...
Monday 6 January 2020
China AI chip development to spur ABF substrate capacity expansion
Taiwan IC substrate makers will have no time to lose in expanding their ABF substrate capacities as demand for such substrates will grow substantially in 2020 and beyond along with...
Thursday 2 January 2020
TSMC reportedly lands InFO_AiP orders for 5G mmWave iPnones
As US leading chipmakers and system vendors are gearing up to commercialize their mmWave technologies, TSMC reportedly has landed a big order from Apple for processing handset antenna...
Friday 13 December 2019
IC substrate suppliers see clear order visibility stretch into 2020
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...
Wednesday 6 November 2019
Two PCB makers expected to share bulk of SLP orders for next iPhone
Taiwanese PCB maker Zhen Ding Technology (ZDT) and Austrian peer AT&S are expected to together land at least 50-60% of substrate-like PCB orders for Apple's next iPhones to be...
Tuesday 5 November 2019
Chip demand for TWS devices to surge sharply in 2020
Global shipments of TWS (true wireless stereo) earphones are expected to surge sharply to 150-200 million sets in 2020 from around 100 million sets estimated for 2019, providing strong...
Wednesday 30 October 2019
Kinsus, Nan Ya reportedly among SiP substrate suppliers for new AirPods
Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt...
Thursday 22 August 2019
ABF substrate demand to stay robust through 2020
ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...
Wednesday 7 August 2019
PCB makers increasing ABF substrate capacity
IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...
Wednesday 5 June 2019
Unimicron, Kinsus to expand additional ABF substrate capacities
Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...