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Friday 26 November 2021
UMC agrees to pay to settle lawsuit with Micron
United Microelectronics (UMC) has agreed to make a one-time payment of an undisclosed amount to Micron Technology according to a settlement agreement reached between the two. As part...
Friday 26 November 2021
Taiwan IC design houses brace for profit erosion
Taiwan-based IC design houses particularly second-tier players are poised to see their profits eroded by rising foundry costs in 2022, as their customers are increasingly reluctant...
Thursday 25 November 2021
Samsung to set up advanced wafer fab in Texas
Samsung Electronics has announced plans to invest an estimated US$17 billion in the establishment of a new semiconductor manufacturing facility in Taylor, Texas. The fab will be dedicated...
Wednesday 24 November 2021
Smartphone AP suppliers demanding 12-inch fab capacity for PWM ICs
Smartphone application processor vendors including Apple, Qualcomm and MediaTek have moved to reserve the available 12-inch BCD (bipolar-CMOS-DMOS) process capacity at foundries for...
Wednesday 24 November 2021
EV manufacturing drives demand for machine tools, robots
According to Japan Machine Tool Builders' Association (JMTBA), machine tool orders from China have been increasing for 16 consecutive months and grew 24.5% on-year in October.
Tuesday 23 November 2021
TSMC ecosystem partners see bright prospects ahead
TSMC's ecosystem partners, particularly equipment makers, are poised to embrace strong growth momentum, as the foundry will be expanding its fab capacities over the next three years,...
Tuesday 23 November 2021
Chipmakers ramping up 176-layer 3D NAND output
Major NAND chip vendors are ramping up their 176-layer 3D NAND chip output in the fourth quarter of 2021, which may bring supply-side variables in the first half of next year, according...
Friday 19 November 2021
GF, Ford partner to address auto chip supply
GlobalFoundries and Ford Motor Company have jointly announced a strategic collaboration to advance semiconductor manufacturing and technology development within the US, aiming to...
Friday 19 November 2021
Taiwan 2nd-tier foundries to enjoy gross margin growth in 2022
Taiwan-based second-tier pure-play foundries, such as Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC), will see their gross margins hike...
Thursday 18 November 2021
Taiwan Mask poised to raise prices in 2022
Photomask supplier Taiwan Mask, which already raised its prices by 10-30% in the first half of 2021, plans to initiate another price hike next year to reflect its tight supply, according...
Thursday 18 November 2021
YMTC improving 128-layer 3D NAND flash manufacturing yields
China's Yangtze Memory Technologies (YMTC) is improving yield rates for 128-layer 3D NAND flash manufacturing, and is on track to scale up its monthly output to 100,000 wafers in...
Wednesday 17 November 2021
MediaTek obtains sufficient foundry capacity for 5G smartphone chips
MediaTek has already struck deals for capacity support over the next one or more years with pure-play foundries, looking to maintain its leading position in the 5G smartphone processor...
Tuesday 16 November 2021
Episil returns to profit
Taiwan-based Episil, a foundry specializing in SiC power devices, returned to profitability in the first three quarters of 2021 from losses a year ago.
Tuesday 16 November 2021
Taiwan IC design houses see gross margins come under downward pressure
With pure-play foundries initiating another price hikes to reflect their continued tight fab capacities, many Taiwan-based IC design houses are finding it increasingly difficult to...
Friday 12 November 2021
DRAM prices to retreat in 4Q21 after strong gains
DRAM ASPs soared 41% through the first eight months of 2021, rising from US$3.37 in January to US$4.77 in August. ASPs slipped 3% to US$4.62 in September, still a 37% surge compared...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.