Infineon Technologies is entering the packaged silicon microphone market, addressing the needs for high performance, low noise MEMS microphones. The analog and digital microphones are based on Infineon's dual backplate MEMS technology and distinguish themselves with a 70 dB signal-to-noise ratio (SNR), according to the coompany. This is combined with a low distortion level of 10% at a 135 dB sound pressure level (SPL). It is in a 4 mm x 3 mm x 1.2 mm MEMS package. Current MEMS microphone technology uses a sound wave actuated membrane and a static backplate. Infineon's dual backplate MEMS technology uses a membrane embedded within two backplates thus generating a truly differential signal, the company said. The SNR of 70 dB is an improvement of 6 dB compared to a conventional MEMS microphone, according to Infineon. This improvement is equivalent to doubling the distance from which a user can give a voice command that is captured by the microphone.

Akustica has announced the expansion of its microphone product portfolio with the addition of a new analog MEMS microphone. Designed specifically to meet the requirements of mobile handset manufacturers, the AKU340 is a high-performance analog microphone that utilizes established surface-micromachining MEMS technology developed by Bosch. The solution measures 2.5x3.35x1.0mm, and offers acoustic performance with 63dB signal-to-noise ratio (SNR) and low frequency recording with a reduction in sensitivity of less than 5dB at 50Hz. With its tight sensitivity matching of just +/-2dB between microphones, the AKU340 is for use in microphone array applications where more uniform microphones lead to increased performance of noise suppression algorithms. The AKU340 is sampling to lead customers now and will be ramping to mass production in the third quarter of 2012. The AKU340 is available at US$1.34 per unit in 1K-unit quantities.

IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field, improving the tools' overlay and critical dimension (CD) tool performance, IMEC said. The sensors were processed according to ASML's custom designs and specifications, with focus on superior lifetime and sensitivity to direct and high EUV irradiation doses. Two of the sensors are designed to calibrate, align and focus tool's lens systems. They have been integrated in functional sensor modules, and are being integrated in the NXE:3100 machines in the field. A third sensor is designed to monitor the NXE:3300's EUV dose. IMEC revealed that the next milestone in progress is to build and qualify the different sensors for the NXE:3300 by the end of 2011.