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NEWS TAGGED MPI
Friday 26 November 2021
IC test interface vendors poised to embrace booming demand for HPC chips
Peripheral backend supply chain players including makers of high-end customized IC testing sockets, wafer probe cards and burn-in boards, apart from ABF substrates, are all gearing...
Thursday 28 October 2021
Backend firms gearing up to embrace chip demand boom for 5G Android phones
OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Thursday 2 September 2021
IC testing interface vendors to enjoy strong demand for new-gen processors
As AMD and Nvidia are warming up for rolling out new-generation CPU and GPU processors in first-half 2022, Taiwan-based IC test solutions providers including Chunghwa Precision Test...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Friday 27 August 2021
Probe card provider MPI to acquire Celadon Systems
Taiwan's leading cantilever probe card maker MPI has announced it has entered into a definitive agreement to acquire US-based Celadon Systems, which specializes in ultra-high performance...
Wednesday 4 August 2021
Testing houses to see strong 1Q22
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
Tuesday 3 August 2021
COF substrate, probe card demand stays robust for processing DDI chips
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Monday 19 July 2021
FCCL maker Taiflex expects slight revenue growth in 2021
Taiwan-based FCCL specialist Taiflex Scientific has reiterated its revenue outlook this year of a slight increase compared to 2020.
Thursday 15 July 2021
Wafer probing houses see order visibility for car chips strenghtened
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Friday 9 July 2021
Zhen Ding, Flexium to see strong shipments for new iPhones in 2H21
Flexible PCB specialists Zhen Ding Technology and Flexium Interconnect, reportedly among the suppliers of flexible antenna modules for the upcoming iPhones and other new Apple devices,...
Monday 5 July 2021
Iteq to develop high-end CCLs for handsets, IC substrates, mmWave antennas
Taiwan's CCL maker Iteq will step up its business diversification, with more efforts on developing high-end CCL materials for handset, IC substrate and flexible mmWave antenna applications,...
Monday 5 July 2021
OSATs see significant surge in 2H21 memory backend demand
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Friday 25 June 2021
Zhen Ding, Flexium enjoy strong Apple orders for antenna modules
Taiwan-based flexible PCB specialists Zhen Ding Technology and Flexium Interconnect will both see revenues generated from antenna modules shipments for Apple devices grow substantially...
Wednesday 16 June 2021
Hermes Testing poised to tap cantilever probe card market
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...