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NEWS TAGGED NAND
Thursday 30 June 2022
Memory chip price drops widen
Spot market prices for DRAM and NAND flash memory chips have started falling rapidly since late June, as downstream module and device companies offload their excess inventories, according...
Wednesday 29 June 2022
ADATA launches industrial-grade 31C series 112-Layer 3D NAND (BiCS5) solid state drives
ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products, today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5)...
Wednesday 22 June 2022
Micron intros 1.5TB microSD card, automotive ASIL-D certified LPDDR5
Micron Technology has announced the company is sampling what it claims is the world's highest-capacity microSD card, the i400, at a density of 1.5 terabytes (TB). This card is designed...
Wednesday 22 June 2022
Top suppliers enjoy big gains in small NOR flash market
NOR flash memory sales surged 63% on year to US$2.9 billion in 2021, representing only 4% of the total flash memory market last year, according to IC Insights.
Monday 20 June 2022
NAND flash price falls may widen to double-digit levels in 3Q22
The 2021 peak demand for NAND flash has passed, and continued downturn in consumer applications is expected to widen price falls for such memory chips to double-digit levels in the...
Tuesday 14 June 2022
Geared up for DDR5 transition: Q&A with Micron EVP Sumit Sadana
The transition to DDR5 memory in the data center sector will be taking place in 2022, and Micron Technology is gearing up for the robust demand, according to Sumit Sadana, executive...
Tuesday 14 June 2022
Yangtze Memory to move directly to 232-layer 3D NAND production
NAND flash chipmaker Yangtze Memory Technologies (YMTC) plans to skip the 192-layer generation and move directly to 232 layers, according to industry sources in China.
Monday 13 June 2022
Micron to commercialize 1-gamma EUV process in Taiwan in 2024
US memory vendor Micron Technology is set to move its 1-gamma EUV process technology to volume production at its new fab, A3, in central Taiwan in 2024, and will install the first...
Thursday 9 June 2022
NAND flash prices to continue slide in 2H22
NAND flash prices are likely to continue trending downward in the second half of 2022, according to sources at memory module makers, which are under increasing pressure to offload...
Monday 6 June 2022
Enterprise SSD revenue up 14% in 1Q22, says TrendForce
Enterprise SSD revenue worldwide grew 14.1% sequentially to US$5.58 billion in the first quarter of 2022, according to TrendForce.
Thursday 2 June 2022
DRAM spot prices continue slide
Spot market prices for DRAM memory continued to fall in May, but the price drops slowed down substantially compared to those in April, according to industry sources.
Friday 20 May 2022
Adoption of QLC SSDs to accelerate in 2023
Chipmakers' entry into the race for 200-plus-layer 3D NAND flash chips will be accelerating the adoption of QLC SSDs particularly in the consumer sector in 2023, according to industry...
Wednesday 18 May 2022
Datacenters to become biggest consumer of NAND flash in 2023-2024
NAND flash demand for datacenter applications will be rising robustly, with bit shipments likely to outpace those for handsets between 2023 and 2024, according to Wallace Kou, president...
Tuesday 17 May 2022
YMTC sampling 192-layer 3D NAND chips
China's Yangtze Memory Technologies (YMTC) has delivered samples of its in-house developed 192-layer 3D NAND flash memory to a few customers recently, according to industry sources...
Thursday 12 May 2022
The memory industry (4): Technology diversion between DRAM and 3D NAND flash
In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.