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NEWS TAGGED NAND
Friday 8 October 2021
Macronix, Phison see 3Q21 revenue hit record high
Flash memory chipmaker Macronix International saw its third-quarter revenue climb a robust 31% sequentially to NT$14.97 billion (US$535.1 million) while revenue at flash device controller...
Monday 4 October 2021
NOR flash to remain tight through 2022
The supply of NOR flash memory has been relatively tight compared to that of DRAM and NAND flash memory, and is expected to remain short of demand through 2022, according to industry...
Friday 1 October 2021
Memory chipmakers under pressure to offload inventory
Memory chip vendors are increasingly under pressure to offload inventory, and have turned aggressive demanding downstream module houses to take delivery of chips starting September,...
Thursday 30 September 2021
Memory contract prices may see larger drops in 1Q22
PC DRAM contract prices are expected to fall about 10% in the fourth quarter of 2021, while contract prices for NAND flash memory will see slight drops. Prices for both DRAM and NAND...
Thursday 30 September 2021
Micron 1α DRAM, 176-layer NAND process yields reach maturity
Micron Technology has seen manufacturing yield rates for its 1α (1-alpha) DRAM and 176-layer NAND process nodes reach mature levels.
Wednesday 29 September 2021
Chip M&A deals reach US$22 billion in first 8 months of 2021
After a record-high start in the first quarter of 2021, semiconductor merger and acquisition announcements cool off a bit without the "megadeals" seen in 2020, according to IC Insi...
Wednesday 29 September 2021
QLC NAND could be adopted in 2022 iPhones
Apple is working with multiple NAND flash chipmakers to develop cost-effective QLC (quad-level cell) NAND flash solutions, and could adopt the memory in its iPhone series as early...
Friday 24 September 2021
NAND flash contract prices to drop up to 5% in 4Q21, says TrendForce
NAND flash memory contract prices are expected to stay flat or drop by up to 5% in the fourth quarter of 2021, according to TrendForce.
Wednesday 22 September 2021
Highlights of the day: NAND chip supply may turn tight in 2H22
NAND flash pices may stablize in 2022, but supply is likely to turn tight in the second half of next year, according to Silicon...
Wednesday 22 September 2021
NAND supply likely to turn tight in 2H22, says Silicon Motion
NAND flash prices are expected to stay stable in 2022, but the supply of such chips is likely to turn tight in the second half of next year, according to Wallace Kou, president of...
Wednesday 22 September 2021
YMTC ready to volume produce 128-layer QLC NAND flash
China-based Yangtz Memory Technologies (YMTC) has shipped over 300 million 64-layer 3D NAND flash memory chips and is ready to volume produce 128-layer QLC (quad-level cell) NAND,...
Wednesday 15 September 2021
Global fab equipment spending to hit another record high in 2022, says SEMI
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly US$100 billion...
Monday 13 September 2021
Chipmakers gearing up for QLC NAND chip output ramp-up
Major NAND flash chip suppliers are poised to ramp up their output for QLC (quad-level cell) NAND chips between the end of this year and 2022, eyeing robust demand for not only PCs...
Monday 30 August 2021
NAND flash controller prices to rise in 4Q21
NAND flash device controller chip prices are under increasingly upward pressure, as foundries are set to initiate further price hikes for mature process technologies later this year...
Thursday 26 August 2021
Global NAND flash output value increases 10.8% in 2Q21, says TrendForce
The global NAND flash industry generated US$16.4 billion in output value in the second quarter of 2021, up 10.8% sequentially, according to TrendForce.
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.