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NEWS TAGGED PACKAGING
Monday 16 May 2022
The memory industry (6): When line between memory and logic IC becomes blurred
In 1984, Intel decided to exit the DRAM business, which marked the start of technology diversion between memories and logic IC. In hindsight, Intel's decision made sense. Memories...
Friday 13 May 2022
The memory industy (5): Looking for a new biz model that can create new value
When the memory industry can no longer leverage Moore's Law to create new value, it has to find new technologies to establish a new business model that can create new economic valu...
Wednesday 11 May 2022
MOSFET maker Force-MOS posts record April revenue
Taiwan's MOSFET supplier Force-MOS Technology saw its April revenue hit a record high for the fourth consecutive month, as tight supply of MOSFET chips remains despite a slowdown...
Wednesday 4 May 2022
Intel mulls adopting TSMC 5nm process in new Meteor Lake chips
Intel is evaluating a revision to its blueprints for the 14th Gen Core "Meteor Lake" CPUs by turning to TSMC's 5nm process family to manufacture all of the integrated chips, according...
Tuesday 26 April 2022
ASE competing with leading foundries, IDMs in advanced packaging segment
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Monday 25 April 2022
Demand for HPC chip analysis, inspection stays strong
Demand for HPC chip analysis and inspection remains robust in the second quarter of 2022, according to industry sources in Taiwan, where major pure-play foundries and OSATs operate...
Thursday 21 April 2022
Packaging material vendors 'rationing' supplies to IDMs, OSATs
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
Thursday 21 April 2022
ASE to complete Chungli factory site expansion in 3Q24
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Thursday 21 April 2022
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
Apple has become a bellwether in the HPC chip segment by rolling out its high-performance M1 series built using advanced process at its foundry partner, but all other manufacturing...
Thursday 21 April 2022
TSMC fan-out packaging to attract orders for Android smartphone SoCs
Apple will no longer be the exclusive customer of TSMC adopting the foundry's advanced integrated fan-out (InFO) wafer-level packaging, which is expected to attract orders for Android...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Monday 18 April 2022
TSMC to see HPC chip orders contribute over NT$700 billion to 2022 revenue
TSMC is expected to see revenue generated from the HPC sector contribute more than NT$700 billion (US$23.9 billion) to the pure-play foundry's total revenue this year, according to...
Wednesday 13 April 2022
Global semiconductor equipment sales surge 44% in 2021, says SEMI
Worldwide sales of semiconductor manufacturing equipment in 2021 surged 44% to an all-time record of US$102.6 billion from US$71.2 billion in 2020, according to SEMI.
Tuesday 12 April 2022
Outlook for IC packaging materials good for 2Q22
Recent lockdown policies along with weak domestic consumer electronics demand in China have caused uncertainty within the semiconductor supply chain.
Thursday 7 April 2022
IC packaging leadframe, substrate prices to rise in 2Q22
Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...