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NEWS TAGGED PACKAGING
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Tuesday 14 September 2021
DDI backend houses to strengthen high-end testing capacity expansions in 2022
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Monday 13 September 2021
China Big Fund stepping up investment in homegrown memory sector
More China-based memory makers will receive cash injections from the government, as China's National IC Industry Investment Fund (Big Fund) steps up its investment in the country's...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Wednesday 8 September 2021
IC analyzer MA-tek sees robust orders for AI chips, 3rd-gen semiconductors
IC analysis and certification lab Material Analysis Technology (MA-tek) has enjoyed a strong influx of MA (materials analysis) and FA (failure analysis) orders for AI chips and third-generation...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Friday 3 September 2021
Backend firms see robust demand for MEMS microphones, audio ICs
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Tuesday 31 August 2021
TSMC launches advanced packaging for silicon photonics applications
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Monday 30 August 2021
BT substrate demand for wire-bonding, memory chips to stay strong till 1Q22
BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset...
Thursday 26 August 2021
UVAT enjoys robust demand for advanced packaging, substrate production
Taiwan-based UVAT Technology, a supplier of etching and sputtering equipment, expects robust demand for advanced packaging and ABF substrate manufacturing to drive its revenue growth...
Wednesday 25 August 2021
Tian Zheng running at full capacity due to rising equipment demand from passive components makers
Tian Zheng International Precision Machinery has benefited from the continuous growth of capital expenditures by the passive component companies in China and Taiwan. The company said...