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NEWS TAGGED PACKAGING
Friday 18 June 2021
ShunSin gearing up for 400G transceiver module packaging services
Backend house ShunSin Technology, a subsidiary of Foxconn Technology (Hon Hai Precision) specializing in system-in-package (SiP) modules, is poised to reap handsome income by rendering...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Tuesday 15 June 2021
IC materials distributors upbeat about sales in 3Q21
Taiwan's semiconductor materials distributors including Topco Scientific, Wah Lee Industrial, Topco Technologies, and Chang Wah Electromaterials are all upbeat about their sales in...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Tuesday 15 June 2021
ADLINK high-efficiency die sorting machine solution increases effectiveness of IC packaging and testing
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted...
Thursday 10 June 2021
IC analyzers sees booming demand for advanced foundry, packaging
Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...
Wednesday 9 June 2021
Surging COVID-19 infections in Taiwan and Malaysia could further constraint notebook component supply
With Asia Pacific countries such as Taiwan and Malaysia witnessing COVID-19 infections surging, sources from the upstream supply chain believe shortages of notebook components could...
Wednesday 9 June 2021
OSATs to log full wire-bonding capacity utilization throughout 2021
Taiwan backend houses have seen clear order visibility for wire-bonding packaging services for notebook- and PC-use peripheral chips throughout 2021, while continuing to embrace strong...
Tuesday 8 June 2021
Greatek says fab suspension unlikely
Over a dozen employees at logic IC packager Greatek Electronics have been infected with COVID-19, but the company has no plans to suspend its fab operations, according to company...
Friday 4 June 2021
TSMC InFO_B packaging gains positive feedback
TSMC's just-unveiled InFO_B packaging technology designed for smartphones enables DRAM stacking flexibility at contract manufacturers, and has received positive feedback from handset...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Tuesday 1 June 2021
Eternal Materials to see strong 2Q21
Eternal Materials, which specializes in resin materials and dry-film photoresists, expects to post double-digit revenue increases both sequentially and on year in the second quarter...
Monday 31 May 2021
Epoxy molding compound supply now 20% short of demand
The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources.