TSMC's equipment suppliers remain optimistic about demand from the foundry, which has been stepping up its pace of advanced technology development and capacity expansion, according...

Vietnam's VinFast has disclosed it has signed an MoU with China's Gotion High-Tech, focusing on the procurement of Gotion's LFP batteries and discussion of the possibility of establishing...

3M has introduced a new member of its high-strength hollow glass bubbles product line to provide a low-loss high-speed high frequency (HSHF) resin additive for composite materials...

Production technology for ABF substrates will be evolving rapidly to satisfy demand for HPC and other high-end chips, according to Tzyy-Jang Tseng, chairman for Unimicron technology...

Phison Electronics has managed to obtain more capacity support from two foundry service providers, and will see its output for 2022 jump 200% from this year, according to KS Pua,...

TSMC reportedly has started installing 3nm process manufacturing equipment at its new Fab 18b.

TSMC is looking to diversify its manufacturing bases for the sustainability of the company's competitiveness, Digitimes Research believes.

TSMC will soon disclose plans to build additional 28nm and 12/16nm process fabrication lines at new fabs, in addition to its Nanjing fab expansion, according to industry sources.

Huawei has reportedly obtained a patent for Si IGBT (insulated gate bipolar transistors) from China's authorities.

DRAM contract prices, which registered a substantial increase in the second quarter of 2021, are expected to continue their rally in the third quarter, according to chipmaker Nanya...

The semiconductor industry will be rising in value over the next 10 years, and may break through the US$1 trillion plateau during the forecast period, according to Nicky Lu, chairman...

Netherlands-based startup InPhocal, which has developed a laser technology for semiconductor cutting, is looking to raise US$2.5 billion during the seed round in 2021.

IC substrate and PCB supplier Unimicron Technology expects to sustain strong shipments throughout 2021, inspired by very clear order visibility for all its major product lines in...

Chipmakers including Broadcom, Qualcomm and MediaTek have entered the early stages of developments for their respective Wi-Fi 7 (802.11be) chips, according to industry sources.

Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...