中文網
Taipei
Sun, Sep 19, 2021
15:53
mostly clear
32°C
CONNECT WITH US
CHT
Sponsored
NEWS TAGGED SEMICONDUCTOR
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 17 September 2021
Highlights of the day: International EV and semiconductor makers team up for SiC modules
Following in the footsteps of International IDMs and automakers to promote their SiC components for EVs, China auto and...
Friday 17 September 2021
Mirle Automation sees order backlog swell
Mirle Automation, dedicated to supplying automated logistics systems and flat panel display (FPD) transporting equipment, has seen its backlog of orders exceed NT$10 billion (US$360.6...
Friday 17 September 2021
GaN Systems strikes deal with BMW
GaN Systems has announced the signing of a comprehensive capacity agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase...
Thursday 16 September 2021
Chip suppliers uncertain about new iPhone sales outlook
Unfavorable macro conditions have had a negative impact on sales of Android smartphones and have also led to uncertainty among chip suppliers about new iPhone sales for the rest of...
Thursday 16 September 2021
Backend firms to see strong 5G RF module demand for iPad mini 6
Backend houses including ASE Technology and Chipbond Technology are poised to enjoy robust orders for processing 5G RF modules, driven by demand for Apple's just-unveiled iPad mini...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Wednesday 15 September 2021
Global fab equipment spending to hit another record high in 2022, says SEMI
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly US$100 billion...
Wednesday 15 September 2021
Vanchip tapping Wi-Fi 6 RF FEM market
China-based Vanchip Technologies, a subsidiary of MediaTek, is partnering with IC distributor WPG and GaAs foundry Win Semiconductors to promote its Wi-Fi 6 RF front-end modules (RF...
Wednesday 15 September 2021
Apple to place orders for around 90 million units of iPhone 13 series for 2021
Apple will place orders for around 90 million units of the freshly launched iPhone 13 series with its upstream assemblers for 2021, Digitimes Research estimates.
Wednesday 15 September 2021
TSMC forecast to post 24% revenue growth in 2021, says IC Insights
TSMC is forecast to see its revenue in the second half of this year grow 14% from the level in the first half, with revenue for all of 2021 set to represent a 24% on-year surge, according...
Tuesday 14 September 2021
SMIC to build additional, considerable 28nm and above process capacity
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 10 September 2021
China silicon wafer maker secures CNY3.3 billion in Series B
Hangzhou Semiconductor Wafer, a silicon wafer subsidiary owned previously by Japan's Ferrotec, has closed CNY3.3 billion (US$510 million) in its Series B funding round and will be...
Thursday 9 September 2021
Wire-bonding to be increasingly needed to process car-use IGBT, SiC modules, says K&S VP
As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide)...